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1、电子产品设计工艺性Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.目录 1概述2电子元器件选用工艺性3印制电路板组装件设计工艺性4整机设计工艺性Evaluation only.Evalua
2、tion only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.1、概述电子产品的设计工艺性，作为电子产品 与零、部（组）件的设计及其制造、组合、 安装、连接、防护与加固等设计的主要内涵 ，有其严格的工艺技术要素和规范要求，是 产品设计的重要属性。
3、其设计工艺性的合理 与否，将直接影响电子产品设计的可制造性 、制造的规范性和产品的可靠性。 Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.1.1 设计工艺性的规范化要求1.2 设计工艺性
4、存在的问题1.3 设计工艺性检查的原则Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.2、电子元器件选用工艺性2.1元器件的选用原则n优先选用国产元器件n元器件应在选用目录或优选目录中选用
5、n新品元器件选用n元器件品种和厂家n元器件参数及使用环境n选择适当的元器件质量等级n以先进、高可靠元器件替代落后、低质量元器件Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.2.2 电子元
6、器件选用的工艺性要求设计选用元器件时，应结合产品的结 构特点，综合考虑元器件的装联方式、占 地效率（二维、三维）、组装厂的工艺和 设备、元器件的可测试性、可更换性、可 获得性、电磁兼容性等。Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright
7、2004-2011 Aspose Pty Ltd.n通孔插装元器件选用工艺性要求n表面贴装元器件选用工艺性要求n螺装元器件选用工艺性要求n元器件焊接工艺性要求n元器件三防工艺性要求n元器件的可检测性Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyri
8、ght 2004-2011 Aspose Pty Ltd.3、印制电路板组装件设计工艺性3.1 PCA设计工艺性要求n元器件布局n防热应力n绝缘、耐电压n引线安装支撑力n导线及跨接线的连接n调试性与测试性Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Cop
9、yright 2004-2011 Aspose Pty Ltd.3.2 元器件通孔插装设计工艺性轴向引线元器件水平安装的布局及要求如下：n元器件水平安装布局及尺寸设计：引线安装 跨度A一般应不大于25.4mm，平行排列元 器件两侧沿之间的安装间隙B、直线型排列 的两相邻连接盘边缘间距C的要求。Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.
10、2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.C 1.27 mmB1.6mm A 25.4 mmB1.6 mm 图3.1 轴向引线元器件水平安装与布局设计Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright
11、 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.n元器件不应摞装布局（除非一个元器件或部件专门 设计成允许另一个元器件与它成为一体），也不应 十字交叉跨装。a.元器件摞装b.元器件跨装图3.2 元器件摞装或跨装（不允许）Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.
12、2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.（2）水平安装的形式n水平贴板安装n水平微间隙安装n水平悬空安装Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty
13、Ltd.Copyright 2004-2011 Aspose Pty Ltd.非轴向引线元器件的安装n TO封装器件安装设计与引线成形（1） TO封装的中、小功率晶体管安装一般采用直 接插装。（2）为了加大TO封装器件安装连接盘的距离，提 高其安装可靠性和维修性，其安装设计可以选取图 3.8a方式，为了降低器件安装高度可采用图3.8b、 c、d设计方式。Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides
14、 for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.b.正向埋头安装成形a.正向立式安装成形A=23 mmA2DB=35 mmC 引线间距 E1.6mmc.反向贴板安装成形d.反向埋头安装成形A=23 mmA=23 mmE1.6mmEvaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Create
15、d with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.n非轴向引线电容器安装与引线成形非轴向引线电容器一般采用立式直插装n双列直插封装器件的安装双列直插封装器件的安装,可以采用直接插装和间接插装两种方式设计。Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0
16、.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.n单面引线元器件的通孔插装主要工艺性要素：1）不应在PCB上进行硬安装（即直接贴PCB表面安 装）。 硬安装焊料渗入不够气密图3.11 元器件与PCB硬安装Evaluation only.Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd.Copyright 2004-2011 Aspose Pty Ltd.2）元器件（例如F型封装大功率管）安装面与PCB之间采用加散热片或
