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1、JOINT INDUSTRY STANDARD Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications4th INTERIM FINALANSI/JSTD-006 JANUARY 1995INDUSTRESEST. 1924CINORTCELIEAASSOCITIONAMERICAN NATIONAL? STANDARDNoticeEIA and IPC Standards and Publicati
2、ons are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the pur- chaser in selecting and obtaining with minimum delay the proper product for his particular nee
3、d. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of EIA or IPC from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by
4、 those other than EIA or IPC members, whether the standard is to be used either domesti- cally or internationally.Recommended Standards and Publications are adopted by EIA and IPC without regard to whether their adoption may involve patents on articles, materials, or pro- cesses. By such action, EIA
5、 and IPC do not assume any liability to any patent owner, nor do they assume any obligation whatever to parties adopting the Recom- mended Standard or Publication. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement.The material in th
6、is joint standard was developed by the Solder Alloy Task Group (5-24c).For Technical Information Contact:Electronic Industries Association Engineering Department 2500 Wilson Boulevard Arlington, VA 22201 Phone (703) 907-7500 Fax (703) 907-7501The Institute for Interconnecting and Packaging Electroni
7、c Circuits 2215 Sanders Road Northbrook, IL 60646 Phone (847) 509-9700 Fax (847) 509-9798Please use the Standard Improvement Form shown at the end of this document.Copyright 1996 by the Electronics Industries Association and the Institute for Interconnecting and Packaging Electronic Circuits. All ri
8、ghts reserved. Published 1996. Printed in the United States of America.No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission of the publisher.AMERICAN NATIONAL? STANDARDAMERICAN NATIONAL STANDARDS INSTITUTEAPPR
9、OVED MARCH 21, 1995 AS ANJ-STD-006Requirements for ElectronicGrade Solder Alloys andFluxed and Non-FluxedSolid Solders for ElectronicSoldering ApplicationsA joint standard developed by the Solder Alloy Task Group (5-24c) of the Institute for Interconnecting and Packaging Electronic CircuitsUsers of
10、this standard are encouraged to participate in the development of future revisions.Contact:EIA Engineering Department 2500 Wilson Boulevard Arlington, VA 22201 Phone (703) 907-7500 Fax (703) 907-7501IPC 2215 Sanders Road Northbrook, IL 60062-6135 Phone (847) 509-9700 Fax (847) 509-9798JOINTINDUSTRYS
11、TANDARDAcknowledgmentMembers of the Solder Alloy Task Group (5-24c) have worked to develop this document. We would like to thank them for their dedication to this effort.Any Standard involving a complex technology draws material from a vast number of sources. While the principle members of the Solde
12、r Alloy Task Group are shown below,it is not possible to include all of those who assisted in the evolution of this Standard. To each of them, the members of the EIA and IPC extend their gratitude.Joining Processes CommitteeSolder Alloy Task GroupTechnical Liaison of the IPC Board of DirectorsChairm
13、an David Schoenthaler AT for fluxedand non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications; and for special electronic grade solders. This standard is a qual- ity control document and is not intended to relate directly to the materials performan
14、ce in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.This document is one of a set of three joint industry standards which prescribe the requirements and test methods for soldering materials for use in the elec- tronics industry and, whe
15、n adopted by a Government, for use on that Governments high reliability elec- tronic hardware: J-STD-004 covering solderingfluxes, J-STD-005 covering solder paste, and J-STD- 006 (this document) covering solder alloys and solid solder forms.Special electronic grade solders include all solders which
16、do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Some examples of special solders are anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder powders, etc.1.2 ClassificationSoldering materials covered by thisstandard shall be classified by alloy composition, solderform, flux type, flux percentage, and by other characteris- tics peculiar to the solder material form.1.2.1 Alloy CompositionThe solder alloys covered
