《激光微细熔覆快速制造厚膜无源元件关键技术的研究》由会员分享，可在线阅读，更多相关《激光微细熔覆快速制造厚膜无源元件关键技术的研究（173页珍藏版）》请在金锄头文库上搜索。
1、 I摘 要 目前，电子行业发展的两大主流是小型化和高频化，传统的厚膜技术由于存在着诸多自身的缺陷，已经远远不能满足中快速发展的需求。因此，在当前日趋激烈的竞争环境下，微电子行业迫切需要发展一种能在无掩模的条件下，快速制备出小尺寸，高精度、高稳定、高可靠性的混合电路的新兴技术。而膜式化元件由于是裸露元件的多层空间叠加和集成，尺寸大大地减少。同时，由于元件直接集成在电路上，使得互连短缩化，焊接点数减少，寄生电阻和电路噪声降低，产品成本下降，因此，为了适应更高密度的元件安装和电路的集成，在表面电路或内层电路上形成埋入式膜式元件，不仅具有产品尺寸小型化的特点，而且在不增大基板面积的情况下达到了高密度集
2、成的目的。 在国家自然科学基金及国家“863”高技术发展研究计划项目的资助下，本文提出了激光微细熔覆快速制造厚膜电子元件和混合电路技术，实现了在陶瓷基板上制备外电路、膜式化无源元件（电阻元件、电容元件、电感元件）和集成模块，并系统研究了预置膜的成型原理和导线、电子元件的制备以及集成等关键科学问题，在此基础上研制出预置膜成型 Precision Spray 系统，并对现有设备进行了改进。本文体现了该项目的部分研究成果，主要研究结果总结如下： 本文率先在国内外提出不需要后续高温烧结工艺，直接采用激光微细熔覆快速制造技术在陶瓷基板上制备了外电路，厚膜电子元件以及集成模块，其制备工艺是采用 Preci
3、sion Spray 系统将电子浆料喷绘在所设定的单元并通电烘干预置膜按照设定的图形进行激光跟踪扫描烘干膜清洗扫描的区域被焊接在基板上。并利用该工艺制备了最小图形分辨率为 20m/40m 的极限值， 大大地突破了传统厚膜制备技术下的极限值。 通过对电子元件和导线的微观形貌、 成分、 组织的分析、电气和机械性能测试以及界面行为的分析，表明采用该技术制备的电路和电子元件，其性能、结合强度均优于传统工艺，而且不存在不同材料界面成分的扩散，稳定性和可靠性高，再现性好，满足目前电子行业和市场发展的需求。 提出了一种制备预置膜层新技术（Precision Spray） ，并利用该技术在基板上制备了表面均匀
4、的预置膜。同时，针对所制备的不同电子元件使用的材料不同，系统地研究了不同浆料下浆料特性和预置膜厚度对电子膜层质量和性能的影响，从而为II后续激光扫描提供了可能。 系统地研究了预置膜的厚度和激光工艺参数对所制备导线和电子元件的膜厚、宽度、质量、性能的影响规律，并确立了极限扫描速度、极限搭接量和极限功率和离焦量范围内的电子膜厚度和宽度范围，简要地分析了这种极限值存在的原因以及对最终产品质量和性能的影响，求得了大面积扫描下最佳的激光加工参数，导线：预置膜厚度 4m，功率密度 1.0x104W/mm2,扫描速度 5mm/s，焦点；电阻：预置膜厚度 15m，功率为 35Watt，扫描速度 3mm/s，两
5、相邻线中心间距为 0.05mm，焦点位置； 电容： 预置膜厚度 6m， 离焦量 1.5mm， 激光加工功率 25Watt， 扫描速度 2mm/s，两相邻线中心间距为 0.2mm；电感（介质膜） ：预置膜厚度 4m，离焦量 6.4mm，激光加工功率 35Watt，扫描速度 3mm/s，两相邻线中心间距为 0.01mm。 通过热分析、SEM、EDS 和探针等分析技术对激光微细熔覆快速制造厚膜电子元件、导线和传统的烧结工艺下制备的电子元件、导线以及两种技术结合制备的电子元件、导线的微观组织形貌、元素分布、界面行为等相关性进行了系统地研究，并结合试验结果和理论分析，探讨了它们的成膜机理、附着机理和导电
6、机理。研究结果表明：采用激光微细熔覆快速制造技术制备的导线和电子元件比传统烧结工艺制备的导线和电子元件质量高，性能优良，可靠性高，不存在不同材料间的界面成分扩散。而激光直接扫描得到的电子元件，再经过高温烧结工艺，性能质量变差。 本文所研究开发的激光微细熔覆快速制造技术与 Precision Spray 系统开辟了一种快速、无掩模、高效、高速、高精度的柔性直写新技术。该技术在新品研发和小批量多品种生产单层和多层电路、电子元件、集成模块等场合，比传统工艺方法成本低，效率高，精度和质量高，稳定性好等。此外，该技术还可以用于微型焊接和复杂的特殊功能混合元件的制备等，具有极大的延展性和广阔的应用前景。
7、关键词关键词： 激光微细熔覆 厚膜 导线 电阻 电容 电感 Precision Spray 系统 混合电路 无源元件 IIIAbstract Today, miniaturized and high frequency products become tow important trend of development in electronic industrial. It cant meet with the need of medium speed and high-speed development more and more because tradition thick-film
8、technology exist many shortcomings. Therefore, under the current drastically competitive environment, it is urgent to need a new technology with small-size, high-precision, high-stability and high-reliability HC can be rapidly fabricated without mask. Size of film component is decreased bigger and b
9、igger because they are piled many coatings in space and integrated by bare components. At the same time, it has many merits when components are directly integrated in circuit, for example, length of interconnection lines is short, numbers of spot weld decrease, dead resistance and circuit noise deba
10、te, and cost of product is down. For the development of high-density film components are assembled in the inner and outer circuits, which will cause the less area of substrate and space used, thereby get to the aim of miniaturized and high-density integration. With the support of National Natural Sc
11、ience Foundation of China and National “863” Hi-Tech Research Resistor film was fabricated by the following parameters, for instance, 15m thickness of pre-set film, 35Watt laser power, 3mm/s scan velocity,0.05mm center distance between lines, focused length; Dielectric film of capacitor was fabricat
12、ed by the following parameters, for example, 6m thickness of pre-set film, 25Watt laser power, 2mm/s scan velocity, 0.2mm center distance between lines, 1.5mmdefocused length; Magnetic dielectric film of inductor was fabricated by the following parameters, for instance, 4m thickness of pre-set film,
13、 6.4mmdefocused length, 35Watt laser power, 3mm/s scan velocity, 0.01mm Vcenter distance between lines. Recur to some analysis technology such as thermal analysis, SEM, EDS and probe etc, this paper detailedly analyzed the relationship of microstructure, element distribute, phase and interface behav
14、ior of components and conductive lines fabricated by this technology and traditional sintering technology along with the combination of them, and discussed their forming mechanism of film, adherence mechanism and conductive mechanism by the analysis of experimental results and theory, results were s
15、hown as following: compared with traditional sintering technology , components and conductive lines rapidly fabricated by the technology of laser micro-cladding were high quality and good property as well as high reliability, and diffusion of composition isnt in the interface of different materials,
16、 however, property and quality of components scanned by laser became bad if they were sintered by high temperature again. Summing up above mentioned, the novel technology of laser micro-cladding and rapid fabrication is a technology of direct writing with merits, for example, no mask, high speed, high precision. Comparison with traditional technologies, the technology is fit to new product research and development as well as small-scale and versatile product
