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1、 Procedure: AP-020402-01 Rev: A Date: August 5, 2002Page 1 of 4LEI 1500 Tool Acceptance ProcedureAll LEI 1500-series instruments will be certified and tested to meet all specifications as stated in this procedure.Linearity testAll LEI 1500-series tools are certified to meet a linearity specification
2、 of +/- 3% from .035 to 3,000 ohms/sq. for a 3-range unit. Single- and dual-range units will also meet the +/- 3% specification within their measurement capabilities. All values are measured as sheet resistance and expressed in Ohms/square. Table I lists the measurement capabilities for 1500-series
3、tools.Procedure:Each range will be verified by using three (3) wafers. One wafer will be used to calibrate the tool and the other two wafers will be used to verify the upper and lower ends of the selected range. Table II lists the appropriate wafers for each range. All wafers are to be placed manual
4、ly on the handler rails.1) Calibrate the tool using the normal calibration procedure and the appropriate calibration wafer(s) listed in Table I for each range of the tool to be tested. Note: always perform a “Rail Calibration” prior to calibrating the High range. 2) After calibration, retest the cal
5、ibration wafer using a 10 center-point plan. Note: a) the Ref Position Delay should be set to 8 seconds, b) click the “Auto Ref On” box to enable this option, and c) if measuring the High range, click the “Auto Zero On” box to enable this option. 3) The measurement of the calibration wafer, after co
6、rrection for the measured temperature, should be within 1% of the certified value (NIST or VLSI) for that calibration wafer. 4) Repeat steps 2 and 3 for the other two (2) wafers (as listed in Table I) for the range. 5) Correct the average measured value for each of the two wafers to correct for temp
7、erature. 6) Compare the temperature-corrected value for each of the two wafers to the certified value provided by the manufacturer (NIST or VLSI). 7) The difference between the average measured value and the certified value must be within +/- 3%.Standard Deviation testAll LEI 1500-series tools are c
8、ertified to meet a repeatability specification. This test is verified by taking repeat measurements on the center of a NIST- or VLSI-certified Silicon wafer. Each test requires 150 center-point measurements and calculation of the Standard Deviation. To convert this value to a % of the certified valu
9、e, divide the Standard Deviation value by the certified sheet resistance value of the standard wafer as listed on the wafer certificate. The result must be equal to or less than the % limits as listed in Table III. All values are measured as sheet resistance and expressed in Ohms/square.Procedure: A
10、P-020402-01 Rev: A Date: August 5, 2002Page 2 of 4Procedure:Each range will be verified by using three (3) wafers within each range. Table III lists the appropriate wafers for each range, along with the specifications for each wafer to be measured. All wafers are to be placed manually on the handler
11、 rails.1) Open the Runtest Module on the desktop. 2) Go to file (click) and choose acceptance test. 3) Choose the appropriate wafer for the range and the setup for that wafer. 4) Click Runtest. This will take a little time. 5) Click Start Test. 6) At the end of the test, choose File and Save. 7) Cli
12、ck Fileand Print Report. 8) Click on printer and make two copies (one for the customers manual and one for acceptance test data to be sent back to LEI.Wafer Mapping TestProcedure:1) Manually place a wafer (100, 125 or 150 mm) on the handler rails. Be sure that the wafer is resting against the wafer
13、locating pins and that the wafer flat is aligned to the appropriate mark on the rails. Note: the wafer alignment pins must be placed in the appropriate holes in the rails for the diameter of the wafer that is to be measured.2) Measure the wafer with the “LEIMap” test plan. This is a 55-point plan. B
14、e sure to enter the exact wafer diameter in the Wafer Diameter field on the RunTest Program screen.3) At the completion of the test verify the following: A) That the wafer has moved approximately .075 inches from the wafer locating pins B) That the wafer flat is parallel to the appropriate engraved
15、mark on the rail - this should be very close to the starting position.4) If both of these conditions are met, the tool has passed this test.On-site VerificationOnce a unit is set up at its final destination, these acceptance tests must be run and the tool must meet the criteria for linearity and rep
16、eatability. Once the unit is verified on site, both the purchasing company and the representative from Lehighton Electronics, Inc. should sign the LEI Tool Installation Record (See attachment). This is required for our warranty files.Procedure: AP-020402-01 Rev: A Date: August 5, 2002Page 3 of 4Table I 1500-series
