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1、Nan Ya CCLCCL Technical Dept., Electronic Materials Div. Nan Ya Plastics Corporation TAIWANNan Ya MultilayerNan Ya Multilayer PCB LaminatesPCB LaminatesNan Ya CCLEnvironmental ProtectionSignal Speed&IntegrityReliabilitySmaller Form FactorPCB Tech TrendsBuild up/HDIPhosphorous FreeImpedance ControlNa
2、rrower Line SpacingFlexibleEmbedded PassivesHigh Layer CountLow Dk/Low LossHi TgInsulationLow CTEHalogen FreeLow Water AbsorptionCAF-Resistant產品開發與應用產品開發與應用Lead Free CompatibleNP-200 (BT Grade) NP-180F (Hi Tg &Low CTE) NP-175(F) NP-155(F) NP-170 NP-150 NP-140M (Low Tg/Hi Td) Anti-CAFMaterials High C
3、TI FR4 NPG NPGN-150 NPG-170 NPGN-170 NPX-200 (For Substrates) BendableCCL Laser Prepreg RCC2 mil & 3 mil CoresUltra thin glass yarn 1037Embedded CapacitanceNPLDII & Low Dk glassNan Ya CCL 南亞產品列表南亞產品列表TG Tg by DSC Suitable for Lead Free Optional for Lead Free NPG(Halogen Free)NPG-200NPG-170NP-LDII NP
4、-175/F NP-170NP-155/F NP-150FR-4 D/S200NPG-180High Tg(H.F) high layer count MLBIC SubstrateNP-200BT Laminate IC SubstratesBT Laminate (H.F)IC Substrate NP-180/FFR-5 Grade high layer count MLB IC SubstrateRCCFR-4 Grade high layer Count MLBHigh Tg (H.F)high layer count MLBHigh performance FR-4 Special
5、 applicationFR-4-86 UV FR-4-98 CTI 600NPG NPGN-150Halogen Free FR-4NP-140M NP-140FR-4 Tetra-functional for MLB180CEM-3 CEM-1CEM-3-86/ CEM-3-01 Halogen free CEM-1-87/ CEM-1-97 CTI600Laser PPLaser drillable prepreg for HDI175150140135130Low Dk/Df High frequency/low lossResin coated copper for HDI18018
6、0OOOOOONan Ya CCL 印刷電路板印刷電路板(PCB) (PCB) 應用應用NP-180RCC Laser P.P移动电话 HDI产品CEM-1 CEM-3电源供应器，监视 器，电视游戏NP-140M NP-140個人電腦, 筆記本 電腦,個人電腦外 設FR-4 個人電腦, 筆記本 電腦 ,個人電腦外 設NP-155(F) NP-150個人電腦,笔记本 电脑 PCMCIA卡NPGN NPG個人電腦& 筆記本 電腦磁盤驅動器NPG-180BGA, CSP, 網絡服務器 NP-200BGA, CSPBGA, CSPNPG-200NP-LD基站NP-175(F) NP-170通信服務器B
7、GA, CSP, 汽車網絡服務器Nan Ya CCL “ “無鉛無鉛” ”對元件組裝影響對元件組裝影響無鉛組裝之焊錫材料熔點更高 回流焊過程有更高的溫度曲線焊錫類型熔點()I.R 最高溫度（ )高溫.Sn-Ag-Cu (96.5 3 0.3)217220245260較高溫度.Sn-Ag-Cu-Bi(in)210220235245一般Pb-Sn (33 67)183225230Nan Ya CCLSoak timeRamp-up rate Lead free reflow (SnAgCu)Tin/Lead(63/37) reflow迴流焊溫度曲線比較迴流焊溫度曲線比較T:30-44T:20-30
8、 Peak TempTime above liquidus (TAL)500100150200250Melting pointLF Melting pointNan Ya CCL高耐熱性高耐熱性(Br-(Br-樹脂樹脂) )覆銅板產品系列覆銅板產品系列NP-150NP-200NP-180TG()NP-140200180175150140BT LaminateFR-5 GradeMedium Tg FR-4FR-4NP-180(F)NP-175NP-175FNP-155NP-155FNP-140 Modify(New)NP-140 Modify(New)High Thermal Stabilit
9、y MaterialNP-170High Tg FR-4Nan Ya CCLNP-140NP170NP140MNP-155FNP-175FThickness (mm)1.61.61,61.61.6DSC Tg135171 135 155170Peel Strength (1oz)12.510.511.59.59.51/2hr PCT moisture0.226%0.190.2100.15%0.147%1/2hr PCT+288 solder dipping330”430”10”1010Z-axis 1/ ppm/67.1606548.349.5Z-axis 2/ ppm/288.0285289
10、256.5259.7CTE 50-260 %4.33.74.33.33.1T-288 delamination 2.07 min255min 30 min 30 minT-260 delamination25.03 min253030min60 min60 minTGA Td (on set)309.2311 323.5 357359TGA 5% Wt Loss311.3312.2 325.9 360361FR-4, NP-155F,NP-175F 特性比對Nan Ya CCLIPC 規范 vs Nan Ya 材料Nan Ya CCLItemFR4NPGNPGN-150NPG-170NPGN-
11、170NPG-180NPG-200Resin systemBr. EpoxyHalogen FreeHalogen FreeHalogen FreeHalogen FreeHalogen FreeHalogen FreeCuring agentDicyDicy Non DicyDicyNon DicyNon DicyNon DicyTg (,DSC)140150145(TMA)170170190(DMA)205(DMA)CTE (%, 50250)4.12.42.42.32.42.22.0T-260 (min)25606060606060T-288 (min)25205204040Td (,T
12、GA)310350360359360367370Dk (1GHz)4.504.604.504.604.534.824.40Df (1GHz)0.0160.0120.0130.0120.0130.0150.013Rigid construction: 4 ply 7628 NPG: “G” for Green (HF) Materials南亚各系列无卤材料特性比較Nan Ya CCLHATS冷热冲击测试结果MaterialA conditionPre-condition 245 reflowx6Pre-condition 260 reflowx6一般材料162-247150-266142-227
13、Mid-TgPN +填充材10001000800-900Hi-TgPN +填充材100010001000无卤材料100010001000Test Condition:-40-145 /1000 cyclesSample:12-layer test vehicleNan Ya CCL热膨胀特性Expansion, PPM/一般材料PN FR4+填充材Hi Tg无卤材料X-CTE Y-CTE1518 15181315 13151113 1113Z-CTE, Before Tg Z-CTE, After Tg58 28745 26035.3 210Nan Ya CCL线路板加工之影响一般材料无卤材料
14、钻孔2,000钻1,500钻除渣OK需调整制程条件黑棕化药水OK接着力较低 压合操作空间較广需调整制程条件印刷线路板加工条件之建议Nan Ya CCL钻孔条件Machine Hole sizSpeedInfeedRTRThkPNL/StsckSchmoll LZ0.30mm160 Kr/min134 IPM437 IPM1.62 ply钻头磨损比较1000 hit2000 hit3000 hit Total (48000 hit)NPG 24.46%30.72%36.52%30.56%NPGN-15025.28%27.32%32.93%28.51%NPG&NPGN-150鑽孔比對測試Nan Y
15、a CCL钻孔精度比較NPGNPGN-150Cp/Cpk1.334/0.7851.859/1.204Target ( 2.0 mil )1325/48098660/481042.75%1.37%Nan Ya CCL钻头磨耗比较新钻头 FR4PN+填充材无卤材料条件Rpm:200K IPM:114.2 Hits:3500 Hole size:10 milNan Ya CCLMaterial typesBlack OxideBrown OxideChemical ABCDStandard FR44.933.854.563.57NPG3.233.123.012.74NPGN-1503.693.463.593.12Unit: lb/in无卤材料内层黑棕化接着强度比较无卤材料内层黑棕化接着强度比较Nan Ya CCL無鹵材性能比較表-CCLNan Ya CCLNPG(Dicy)NPGN-150(PN) PCBLayer10L14L Thicknessmm1.8-2.02.4-2.5 DSC-Tg 155150.6 288 Solder floating 10”-6 cycles10 cycles260 IR Reflow cycles-6-7 cycles10 cycles T-260min8.5824.06 T-288min2.258.68P
