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1、上海交通大学硕士学位论文TX半导体公司竞争力研究姓名：王卫平申请学位级别：硕士专业：工商管理指导教师：黄丹20050610IT X半导体公司竞争力研究 摘 要 半导体产业代表着当代高科技的前沿经过半个世纪的蓬勃发展为信息时代提供了广泛的硬件基础人类进入了硅石时代继平面金氧半导体技术的发明集成电路芯片制造成为近 5 0 年来发展最快的技术循着摩尔定律的规范集成电路芯片最主要的特征参数线宽从 1 9 5 9 年以来的 4 6 年间缩小了 1 4 0 倍平均价格降低了 1 0 7 倍 在高度竞争的市场环境下高科技的精进使芯片的集成度愈来愈密低成本的诉求让晶圆的直径愈做愈大随着产业的成长半导体制造基地
2、发生了地理性迁移同时产业链也发生了分化整合7 0 年代末晶圆代工从集成电路整合器件制造的全程中分解出来成为独立产业并且前景辉煌资金与技术双密集是晶圆代工产业的特征对前沿技术的运用发展能力是产业竞争力的关键因素各自起步于 8 0 年代目前台积电台联电和 T X 半导体已成为晶圆代工厂商中的佼佼者分别以行业领跑者挑战者和追随者的地位贡献了全世界 8 0 的晶圆代工产能供应了全球集成电路芯片 6 的市场需求2 0 0 4 年统计 在高度依赖对前沿技术的掌握应用整合创新并与商业运作紧密结合以创丰厚利润的半导体芯片制造业T X 半导体公司成长的历程比较短对前沿技术的掌握比较慢因此整体的竞争力不尽人意在市
3、场萎缩的打击下公司的运营绩效连续三年乏善可陈与领跑者的差距愈来愈大而中国大陆同业者的迅速成长更使 T X 半导体公司面临着落伍的威胁 应用 S W O T工具本文对构成 T X 半导体公司竞争力的要素进行了分析找出公司内部的优势与劣势结合产业环境的机会和威胁做出了 T O W S策略矩阵为达到近期扭亏为盈的战略目标实现中期阶段跻身产业领跑者的战略地位进而推动企II业迈入永续经营的鸿图大业本文建议 T X半导体公司在总体战略层面上要有大作为可以考虑的战略方案是 1 横向一体化并购 I B M属下的半导体事业部整合更大的产能及智慧产权库以提高竞争力取得晶圆代工产业世界第二的市场地位 2 自主开发核
4、心技术通过消化整合发展与 I B M合并的技术优势在集成电路技术及产品制造领域以 5年期追随1 0年期超越争取 1 5年内跻身为行业领跑者 3 开发中国市场在与 I B M合并的总体战略架构下加快中国大陆市场的开发与当地的芯片设计公司F a b - l e s s 长期合作以求市场扩大与中国的同业者联营以共享市场份额与产能资源 关键字半导体产业集成电路芯片晶圆代工竞争力竞争战略企业并购中国市场 IIICOMPETITIVENESS STUDY OF TX SEMICONDUCTOR MANUFACTURING LTD ABSTRACT Semiconductor industry repres
5、ents the leading edge in modern advance technology. The advancement of semiconductor technology in the last half of the century has provided the broad base hardware foundation for the era of information technology. Mankind has entered a new “Silicon Age”. Following the invention of planar metal-oxid
6、e semiconductor, the production of IC has seen the fastest growth in the last 50 years. Based on the Moores law, the IC technology node has been drastically reduced by 140 times in the last 46 years, the average price has also reduced by 107 times. With increasing competition and advance technology
7、development, the node of IC chip is getting smaller and more compact. The pursuit of low cost production has also pushed the diameter of silicon wafer to grow larger. As the industry grow, the semiconductor manufacturing base has shifted its geographical locations. At the same time, the industry und
8、ergone disintegration and reorganization. In the late 70s, the production shifted from total IDM manufacturing into wafer foundry. The future of wafer fab seems promising. High capital investment and advance technology are 2 unique aspects of wafer fab. The state-of-the-art technology research and d
9、evelopment is the key to the competitiveness of this industry. Started in the 80s, TSMC, UMC and TX semiconductors have became the leaders in wafer fab industry. As leader, challenger and follower, they have respectively contributed to 80% of worlds silicon wafer foundry capacity that supplied 6% of
10、 the global semiconductor demand (2004 statistics). In an industry that is highly dependent on mastering the state-of-the-art technology, its application, consolidation, innovation, and close link with business joint venture in order to create lucrative profit, TX semiconductor has a shorter growth
11、history and slower grasp on the state-of-the-art technology. Hence, it is not able to compete effectively as one would expect. With a weakening demand, the company operating results have not IVbeen promising for 3 years in a row. The gap between TX and leading competitors has grown wider. This is co
12、mpounded with the fast pace development of counterparts in China, TX Semiconductor is faced with the threat of becoming obsolete. Using the SWOT analysis, this thesis attempts to analyze the essential features of TX Semiconductor competitiveness in order to discover the strengths and weaknesses of t
13、he internal organization. By combining the study of the opportunities and threats posed by the environment, the thesis developed the TOWS strategic matrix. This is done to achieve the short term strategic objective of turnaround profit, fulfill mid term goal of becoming a leader in strategic positio
14、ning in order to push the industry into achieving sustainable profit objective. The author suggests that for TX Semiconductor to make significant impact on its overall strategy, the following options can be considered: 1) Lateral consolidation. Acquire IBMs semiconductor business in order to enlarge
15、 production scale and Intellectual Property rights to improve its competitiveness and become the world second largest wafer fab in terms of market share 2) Establish its own research and development competency. This is done by restructuring and integrating the technology advantage provided by IBM. S
16、et a target of becoming a follower in 5 years, exceed the competitor in 10 years and eventually becoming the industry leader in 15 years. 3) Develop the Chinas market. Expedite the business expansion in China under the strategic merger program with IBM. Work out a long term partnership plan with local IC design companies (Fab-less) in China in order to expand the market. Set up joint venture with Chinas IC producers to enjoy the market share and production resou
