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1、 FOR IMMEDIATE RELEASE EV GROUP UNVEILS ITS NEXT-GENERATION EVG150 AUTOMATED RESIST PROCESSING PLATFORM FOR HIGH-VOLUME COATING/DEVELOPING APPLICATIONS Redesigned, Fully Automated Modular System Integrates Unmatched Spray Coating Processes for MEMS, Compound Semiconductors and Advanced Packaging SEM
2、ICON TAIWAN, Taipei, September 4, 2012 EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation EVG150 automated resist processing system. The high-volume coater/developer has been complet
3、ely redesigned to provide customers with a flexible, modular platform that integrates spin coating and developing with EVGs advanced, proprietary spray coating technology. “Close collaboration with our customers made it clear that the next logical step for our coater/developer technology was to crea
4、te a universal approach for high-volume processing of devices with more complicated structures and topographies,” stated Markus Wimplinger, EV Groups corporate technology development and IP director. “This latest incarnation of our EVG150 system addresses customers production needs for back-end lith
5、ography, conformal coating and planarization all in one modular, fully automated platform. Leveraging EVGs 15 years of experience in resist coating and developing, and particularly our spray coating, the EVG150 is ideally suited for high-volume coater/developer applications needing increased uniform
6、ity and process flexibility.” Part of EVGs resist processing equipment family, which addresses all wafer sizes up to 300 mm, the EVG150 platform can accommodate wafers from 50 mm to 200 mm in diameter, and enables up to four wet process modules to be combined with two stacks of hot plates, chill pla
7、tes and vapor prime modules. The system performs spin coating, developing, spray coating and lift off, and its modular structure helps minimize system downtime and improve serviceability. Throughput is optimized via EVGs latest Computer Integrated Manufacturing (CIM) Framework software platform and
8、unmatched process control. EVG currently has more than 100 customers implementing its proprietary OmniSpray technology, which is also integrated into the new EVG150 resist processing platform. EVGs OmniSpray technology specifically allows the conformal coating of high topography surfaces via its pro
9、prietary ultrasonic nozzle. Spray coating technology is ideally suited for ultra-thin, fragile or perforated wafers. Additionally, the implementation of OmniSpray coating can result in a greater-than-80-percent reduction in material consumption compared to traditional spin coating. Another available
10、 option for the EVG150 platform is EVGs NanoSpray technology, which is an enhanced, patented coating technique that can coat surfaces with vertical sidewall angles thus, for example, enabling conformal coating of through-silicon vias (TSVs) with polymer liners and photoresist. The modular EVG150 aut
11、omated resist processing platform is available immediately for demonstration and evaluation. For media interested in learning more about EVGs technology solutions, please visit EV Group at booth #1076 at SEMICON Taiwan in Taipei, where the company will be exhibiting from September 5-7, 2012. -more-
12、EV GROUP UNVEILS EVG150 AUTOMATED RESIST PROCESSING PLATFORM.PAGE 2 OF 2 About EV Group (EVG) EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnolo
13、gy devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and part
14、ners all over the world. More information about EVG is available at www.EVG. Contacts: Clemens Schtte Brandy Lee Director, Marketing and Communications Account Director EV Group MCA, Inc. Tel: +43 7712 5311 0 Tel: +1.650.968.8900, ext. 129 E-mail: MarketingEVG E-mail: # EVG 發表發表新一代新一代 EVG150 自動化光阻製
15、程系統自動化光阻製程系統 為為高產能塗佈高產能塗佈/顯影應用顯影應用提供提供理想平台理想平台 全新設計全新設計的的全自動化模組系統，結合傑出無可匹敵的噴霧式塗佈全自動化模組系統，結合傑出無可匹敵的噴霧式塗佈技術技術， 適用於適用於MEMS、化合物半導體與先進封裝化合物半導體與先進封裝等產業等產業 微機電系統(MEMS)、奈米技術與半導體晶圓接合與微影技術設備領導廠商 EV Group (EVG)宣布，將於 9 月 5 日至 7 日登場的 SEMICON Taiwan 2012 國際半導體展中發表新 一代 EVG150 自動化光阻製程系統。全新設計的高產能光阻塗佈/顯影設備可以提供客戶 一個高靈
16、活度的模組化平台，可在同一機台結合旋轉式塗佈顯影製程和 EVG 先進的專利 型噴霧式塗佈技術。 EVG 技術開發與 IP 部門主管 Markus Wimplinger 表示：與客戶緊密合作可讓我們了解， 塗佈/顯影設備的未來技術發展需要為結構更複雜和表面有更多微結構的元件設計一個通 用型的方法，使其可提供高產能的處理功能。 最新的 EVG150 系統可滿足客戶在後段微 影製程(back-end lithography)、加入絕緣保護膜 (conformal coating)，以及 緩和縱向構造段差的凹凸情況時(planarization)的各種生產需求，而這些都可在單一模組 和全自動化的平台上進行。EVG150 系統運用了 EVG 在光阻處理與顯影技術的十五年豐 富經驗，尤其是噴霧式光阻塗佈方面的精湛技術，因而適用於各種需要更高一致性和製程 彈性的
