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1、无无 铅铅 生生 产产 带带 来来 的的 问问 题题 及及 解解 决决 方方 法法 技技 术术 讲讲 座座主办单位主办单位: :深圳拓普达资讯有限公司深圳拓普达资讯有限公司中国电子学会中国电子学会 SMTSMT 咨询专家委员会办事处咨询专家委员会办事处中国电子专用设备工业协会中国电子专用设备工业协会美国美国 SMTASMTA 深圳办事处深圳办事处大力发展面向大力发展面向“世界工厂世界工厂”的职业教育和培训的职业教育和培训 您能从此课程中学到哪些内容：您能从此课程中学到哪些内容： 这个课程覆盖了电子行业在无铅转换中发生的焊接相关的问题。更重要的是它也体现了近年来行业在尽力解决这些问题作出的努力和
2、成果。强调了波峰焊，选择性波峰焊和维修的制造工艺。讲述表面处理引起的问题，特别是锡须。关于焊料的选择，会提及什么样的合金焊料是合适的，权衡利弊，如何选择及评估。详细讨论那些难以避免的问题例如混合合金及便携设备对冲击损坏的敏感性. 基于有价值的案例提供建议.最后，回顾近来在对可靠性以及机械性关键因素的研究，来回答如何实现高可靠性的问题。What You Can Learn From This Course:This course covers the soldering related issues ailing the electronic manufacturing industry dur
3、ing lead-free conversion. Most importantly, it also presents the most recent efforts and results of the industry in trying to resolve those issues. The manufacturing practice emphasizes on wave soldering, selective soldering, and rework. The problems caused by surface finishes, particularly tin whis
4、kers, are addressed. Regarding the solder materials, what solder alloys are available for selection, what is the pro and con, how to select, and how to evaluate, are presented. The inevitable issues such as mixed alloys and sensitivity of portable devices toward impact failure are discussed in detai
5、ls, with advices provided based on valuable cases study experience. Finally, the questions about how to deliver a high reliability are answered with a close review of most recent studies on critical factors affecting reliability and the mechanisms involved. 谁应该参加此课程：谁应该参加此课程：任何对关心实现高直通率和高可靠性的无铅焊点及想了
6、解如何实现的相关人员都应该参加。 Any one who care about achieving high yield and high reliability lead-free solder joints and like to know how to achieve them should take this course. 本课程将涵盖以下主题本课程将涵盖以下主题：主题主题TopicsTopics 1. 表面处理问题(1) 裂缝腐蚀 (2) 各种表面处理的品质和性能(3) 各种表面处理的可靠性比较2. 锡须 长期的威胁(1) 锡须产生的原理(2) 锡须的测量(3) 锡堆积物残余应力测
7、量(4) 量化锡须的结晶及增长(5) 加速锡须测试(6) 锡须缓和: 使用者视角3. 波峰焊及选择性波峰焊(1) 针对波峰焊和选择性波峰焊的设计(2) 助焊剂的选择和应用(3) 合金类型对铜腐蚀及焊接的影响(4) 流程参数和优化的影响(5) 大而厚的板子 - 通孔的填充和空洞对可靠性的影响4. 返工(1) 减少不良的期望流程。(2) 铜移除的维修参数和合金类型。(3) 维修次数及合金类型对可靠度的影响。(4) BGA & LCC 的维修(5)低 mp 合金1. Issues of Surface Finish (1) Creep corrosion(2) Quality and perform
8、ance of various surface finishes(3) Comparison of reliability of various surface finishes2. Tin Whisker The Lingering Threat(1) Formation mechanism of Tin Whiskers(2) Measurement of Tin Whiskers(3) Residual Stress Measurement of Sn Deposits(4) Quantifying the Role of Stress on Whisker Nucleation and
9、 Growth (5) Accelerated Tin Whisker Test (6) Tin Whisker Mitigation: User Perspective 3. Wave and Selective Soldering(1) Design for wave and selective soldering(2) Flux selection and application(3) Effect of alloy type on Cu erosion and soldering(4) Effect of process parameters and optimization (5)
10、Large thick board - Effect of hole fill and voiding on Reliability 4. Rework(1) Desired process for reducing defects(2) Rework parameters and alloy type on Cu removal(3) Effect of rework cycles and alloy type on reliability(4) Rework on BGA & LCC (5) Low mp alloys for rework 5. 怎么处理混合合金(1) 运送可靠性 (2)
11、 外部可靠度(3) 流程优化6. 替换的无铅焊料合金(1) 低 Ag 合金(2) 高 Cu 合金(3) 低温焊膏(4) 新型合金(5) 组合的坚固和耐热的特征(6) 选择和评估新合金的策略7. 便携设备可靠性(1) 裂纹扩展(2) 脆性失效原理(3) 塑料变形和寿命限制(4) 合金类型和微量添加剂对于冲击可靠性的影响(5) BGA 风险评估8. 关于可靠性的新发现5. How to Handle Mixed alloys(1) Forward reliability(2) Backward reliability(3) Process optimization6. Alternative Le
12、ad-Free Solder Alloys(1) Low Ag alloys(2) High Cu alloys(3) Low temperature solder(4) Novel new alloys(5) Combined non-fragility and thermal fatigue features(6) Strategy in selecting and evaluating new alloys7. Portable Devices Impact Reliability (1) Crack propagation (2) Brittle failure mechanism(3
13、) Plastic deformation & life prediction (4) Effect of alloy type and micro-additives on impact reliability (5) BGA risk assessment 8. New Findings on Reliability(1) Mechanical properties of lead-free solder (1) 无铅焊膏的机械性能(2) 成分，焊盘金属化和流程的状态冷却率的影响(3) Ni 对弯曲的影响(4) 老化温度和保留时间的影响 (5) 连接的大小和翘曲的影响(6) 颗粒大小比例系
14、数和质地的影响(7) 锡颗粒数量和方向的影响(8) 保养环境的影响(9) 微孔的构造(10) 破裂机构和缝隙的增长(11) 焊盘脱落(12) 震动测试的可靠性(13) 锡须增长 - 结晶结构大小的影响(2) Effect of composition, pad metallization, and process condition & cooling rate (3) Effect of Ni addition on bending (4) Effect of aging temp and dwell time (5) Effect of joint size and warpage, (6
15、) Effect of scaling factor on grain size and texture(7) Effect of tin grain number and orientation(8) Effect of service environment(9) Microvoid formation(10) Fracture mechanism and fatigue crack growth(11) Pad crater failure (12) Vibration Test reliability(13) Creep effect of size on crystal structure证证 书：书：由中国电子专用设备协会颁发培训证书由中国电子专用设备协会颁发培训证书（在深圳市拓普达资讯有限公司和中国电子专用设备协会有备案，并可在 查询）。培训时间：培训时间：2011 年年 5 月月 7-8 日日(苏州）苏州） / 2011 年年 5 月月 14-15 日（深圳）日（深圳）培训地点：培训地点：深圳南山区/苏州平江区培训费用：培训费用：SMTe 会员价：会员价：￥2000 元元/人人 非会员价：非会员价
