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1、 Everlight Electronics Co., Ltd. http: Rev 1 Page: 1 of 10 Device No：DTR-026-270 Prepared date：03-06-2006 Prepared by：Posen Hsu Technical Data Sheet 1.6mm round Subminiature Side Looking Infrared LED IR26-51C/L110/TR8 Features Small double-end package Low forward voltage Good spectral matching to Si
2、 photo detector Package in 8mm tape on 7diameter reel. Pb free The product itself will remain within RoHS compliant version. Descriptions IR26-51C/L110/TR8 is an infrared emitting diode in miniature SMD package which is molded in a water clear plastic with spherical top view lens. The device is spec
3、trally matched with silicon photodiode and phototransistor Applications PCB mounted infrared sensor Infrared emitting for miniature light barrier Floppy disk drive Optoelectronic switch Smoke detector Device Selection Guide Chip LED Part No. Material Lens Color IR GaAlAs Water Clear 020-22074733 QQ
4、2462655096Everlight Electronics Co., Ltd. http: Rev 1 Page: 2 of 10 Device No：DTR-026-270 Prepared date：03-06-2006 Prepared by：Posen Hsu IR26-51C/L110/TR8 Package Dimensions Notes: 1.All dimensions are in millimeters 2.Tolerances unless dimensions 0.1mm Absolute Maximum Ratings (Ta=25) Parameter Sym
5、bolRating Units Continuous Forward Current IF 65 mA Reverse Voltage VR 5 V Operating Temperature Topr -25 +85 Storage Temperature Tstg -40 +100 Soldering Temperature *1 Tsol 260 Power Dissipation at(or below) 25Free Air Temperature Pd 130 mW Notes: *1:Soldering time5 seconds. Everlight Electronics C
6、o., Ltd. http: Rev 1 Page: 3 of 10 Device No：DTR-026-270 Prepared date：03-06-2006 Prepared by：Posen Hsu IR26-51C/L110/TR8 Electro-Optical Characteristics (Ta=25) Parameter Symbol Condition Min.Typ. Max. Units IF=20mA 1.0 3.5 - Radiant Intensity Ie IF=100mA Pulse Width100s ,Duty1%- 15 - mW /srPeak Wa
7、velength p IF=20mA - 940 - nm Spectral Bandwidth IF=20mA - 45 - nm IF=20mA - 1.2 1.5 IF=100mA Pulse Width100s ,Duty1%- 1.5 1.8 Forward Voltage VF IF=1A Pulse Width100s ,Duty1%- 2.6 4.0 V Reverse Current IR VR=5V - - 10 A View Angle 21/2 IF=20mA - 20 - deg Everlight Electronics Co., Ltd. http: Rev 1
8、Page: 4 of 10 Device No：DTR-026-270 Prepared date：03-06-2006 Prepared by：Posen Hsu 0 -2504020601008020406010080120140020406080100IF=20mA Ta=25 C75-25900 0920940255096098010001010110231041234IR26-51C/L110/TR8 Typical Electro-Optical Characteristics Curves Fig.1 Forward Current vs. Fig.2 Spectral Dist
9、ribution Ambient Temperature Fig.3 Peak Emission Wavelength Fig.4 Forward Current Ambient Temperature vs. Forward Voltage Everlight Electronics Co., Ltd. http: Rev 1 Page: 5 of 10 Device No：DTR-026-270 Prepared date：03-06-2006 Prepared by：Posen Hsu -200.60.90.70.81.00.20.400.2 0.4 0.65070 80604030-1
10、002010IF-Forward Current (mA)101001011023104Ie-Radiant Intensity(mW/sr)1001001000IR26-51C/L110/TR8 Typical Electro-Optical Characteristics Curves Fig.5 Relative Intensity vs. Fig.6 Relative Radiant Intensity vs. Forward Current Angular Displacement Everlight Electronics Co., Ltd. http: Rev 1 Page: 6
11、 of 10 Device No：DTR-026-270 Prepared date：03-06-2006 Prepared by：Posen Hsu IR26-51C/L110/TR8 Precautions For Use 1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moi
12、sture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be kept at 30 or less and 90%RH or less. 2.3 The LEDs should be used within a year. 2.4 After opening the package, the LEDs should be kept at 30 or less and 70%RH or less. 2.5 The LEDs should be use
13、d within 168 hours (7 days) after opening the package. 2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 605 for 24 hours. 3. Soldering Condition 3.1 P
14、b-free solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. http: Rev 1 Page: 7 of 10 Device No：DTR-026-270 Prepared date：03-06-2006 P
