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1、N e v e r s t o p t h i n k i n g .ISOFACETMISO1H801GCoreless Transformer Isolated Digital Output 8 Channel 0.625A High-Side SwitchDatasheet, Version 2.3, September 2009Power Management after DIS set to high a new write cycle is necessary to set the output again.Normal operation Turn-off time to 10%
2、 VOUT RL = 47tDIS-85170sOutput disable time (transition DIS to logic low)3)The parameter is not subject to production test - verified by design/characterization1)2)3)Disturbed operation Turn-off time to 10% VOUT RL = 47tDIS-2304.8Parallel Interface Input TimingParameter at Tj = -25 . 125C, Vbb=15.30
3、V, VCC=4.5.5.5V, unless otherwise specifiedSymbolLimit ValuesUnitTest Conditionmin.typ.max.WR pulse widthtWRPW20nsData setup time before WRtDS20Data hold time after WRtDH10Chip select valid to WRtCSWR0WR logic high to CS logic hightWHCS10Delay to next CS cycletCSD10ISOFACE ISO1H801GElectrical Charac
4、teristicsDatasheet15Version 2.3, 2009-09-164.9Reverse VoltageParameter at Tj = -25 . 125C, Vbb=15.30V, VCC=4.5.5.5V, unless otherwise specifiedSymbolLimit ValuesUnitTest Conditionmin.typ.max.Reverse voltage1)defined by Ptot2)not subject to production test, specified by design1)2)RGND = 0 RGND = 150
5、-Vbb 1 45VDiode forward on voltage IF = 1.25A, VDx = low, each channel-VON 1.24.10Isolation and Safety-Related SpecificationParameter Measured from input terminals to output terminals, unless otherwise specifiedValueUnitConditionsRated dielectric isolation voltage VISO500VAC1 minute duration 1)The p
6、arameter is not subject to production test, verified by characterization; Production Test with 1100V, 100ms duration1)Minimum external air gap (clearance)2.6mmshortest distance through air.Minimum external tracking (creepage)2.6mmshortest distance path along body.Minimum Internal Gap0.01mmInsulation
7、 distance through insulationNote: For Qualification Report contact your local Infineon Technologies office!Datasheet16Version 2.3, 2009-09-16ISOFACE ISO1H801GElectrical CharacteristicsDatasheet17Version 2.3, 2009-09-16ISOFACE ISO1H801GElectrical CharacteristicsDatasheet18Version 2.3, 2009-09-16ISOFA
8、CE ISO1H801GPackage Outlines5Package OutlinesBottom ViewDoes not include plastic or metal protrusion of 0.15 max. per side1180.250.11.136+0.13 0.2536x19M(Heatslug)15.740.650.1CA B19C3.253.5 MAX.+0.100.10.1362.8B110.151)1.350.253-0.02+0.076.314.2(Mold)0.3B0.150.25Heatslug0.95Heatslug0.15.93.2 (Metal)
9、0.1(Metal)13.7(Metal)101 -0.2Index Marking(Mold)15.91)0.1A1 x 451)gps09181_1PG-DSO-36(Plastic Dual Small Outline Package)Figure 11PG-DSO-36Published by Infineon Technologies AGw w w. i n fi ne on .c o mQualitt hat fr uns eine umfassende Bedeutung. Wir wollen allen Ihren Ansprchen in der bestmglichen
10、 Weise gerecht werden. Es geht uns also nicht nur um die Produktqualitt unsere Anstrengungen gelten gleichermaen der Lieferqualitt und Logistik, dem Service und Support sowie allen sonstigen Beratungs- und Betreuungsleistungen.Dazu gehrt eine bestimmte Geisteshaltung unserer Mitarbeiter. Total Quali
11、ty im Denken und Handeln gegenber Kollegen, Lieferanten und Ihnen, unserem Kunden. Unsere Leitlinie ist jede Aufgabe mit Null Fehlern“ zu lsen in offener Sichtweise auch ber den eigenen Arbeitsplatz hinaus und uns stndig zu verbessern. Unternehmensweit orientieren wir uns dabei auch an top“ (Time Op
12、timized Processes), um Ihnen durch grere Schnelligkeit den entscheidenden Wettbewerbsvorsprung zu verschaffen. Geben Sie uns die Chance, hohe Leistung durch umfassende Qualitt zu beweisen. Wir werden Sie berzeugen.Quality takes on an allencompassing significance at Semiconductor Group. For us it mea
13、ns living up to each and every one of your demands in the best possible way. So we are not only concerned with product quality. We direct our efforts equally at quality of supply and logistics, service and support, as well as all the other ways in which we advise and attend to you. Part of this is t
14、he very special attitude of our staff. Total Quality in thought and deed, towards co-workers, suppliers and you, our customer. Our guideline is “do everything with zero defects”, in an open manner that is demonstrated beyond your immediate workplace, and to constantly improve. Throughout the corporation we also think in terms of Time Optimized Processes (top), greater speed on our part to give you that decisive competitive edge. Give us the chance to prove the best of performance through the best of quality you will be convinced.Total Quality Management
