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1、COB Bonding Procedure一 DefinitionChip on Board (COB) refers to a kind of processing technique by which the IC is bonded with PCB.二 ProcedureStep . PCB CleaningClean the PCBs pad on which the IC would be bonded with an eraser, and then clean it again with the help of brush. At last, put the PCB on th
2、e aluminum plate in the same direction. If there are other components on the back of the PCB, foam should be put under it in case that the components are destroyed. This step aims to prevent insufficient solder and provide convenience for following bonding.Step . IC AttachmentInject some red glue to
3、 the syringe and make sure it takes about 1/3 of the syringes capacity. Next, put right amount of red glue to the centre of the bonding section and attach the IC lightly in the right direction. Meanwhile, the flatness and cleanness of the IC surface should be guaranteed.Step . BondingAfter adjustmen
4、t of the bonding machines technical data and central point, as well as the power of IC and PCB, put the PCB attached with IC on the proper place of the machine to conduct the bonding process and then use microscope to check the quality of soldering points, including size, length and the end of the l
5、ine.Step . TestingTest the product on the basis of engineering requirement with the testing machine to check if there are any defections, such as messy code, half display, no display and so on. If some defective products are found, the maintaining will be conducted as soon as possible. The product s
6、hould not be put into next procedure until its tested to be perfect.Step . Sealing and BakingPut more than two pieces of bonded products on preheating board so that the glue to be sealed later can distribute well on the proper place. A few seconds later, conduct the sealing process with machine or b
7、y hand with the purpose of preventing the IC, aluminum wire and pad to be oxidized. During the process of baking, the temperature should be adjusted to 12510 and the process should last for 50 to 70 minutes for curing.Step : TestingTest the final products again and maintain the defective products from the first procedure.Step : CodingCode the qualified products with the inkjet printer according to the customers requirements.
