《[精选]铝基板制作流程》由会员分享，可在线阅读，更多相关《[精选]铝基板制作流程（30页珍藏版）》请在金锄头文库上搜索。
1、競華電子(深圳)有限公司,A+PCB Electorics(Shen Zhen)Co.,LTD,鋁基板制作流程介紹,1,競華電子(深圳)有限公司,A+PCB Electorics(Shen Zhen)Co.,LTD,一、鋁基板制程 1、噴錫流程： 來料檢查 一次沖/ 鑽孔圖形轉移圖形檢查蝕刻退膜蝕檢阻焊制作 打定位孔字符制作噴錫噴錫檢查單面磨板（依客戶要求而定） V-CUT/成型通斷測試高壓測試FQC、FQA包裝入庫,2,競華電子(深圳)有限公司,A+PCB Electorics(Shen Zhen)Co.,LTD, 2 、OSP 流程 来料检查一次冲/钻孔图形转移图 形检查蚀刻退膜蚀检阻焊制
2、作 打定位孔字符制作V-CUT/成型 测试FQC、FQAOSPFQC包装入库,3,競華電子(深圳)有限公司,A+PCB Electorics(Shen Zhen)Co.,LTD,二、制程制作事项 2.1来料检查IQC A、铜面检查：不允许有凹坑、擦花和严重氧化痕迹； Cu surface check: Notches, scratches and serious oxidation are not allowed. B、保护膜检查：保护膜不应有破损至铝面露出； Protective film check: Protective film mustnt be broken withCu expo
3、sure. C、厚度检查：按流程卡要求检测板厚、铜厚。 Thickness check: Check board thickness and Cu thickness according to lot card.,4,競華電子(深圳)有限公司,A+PCB Electorics(Shen Zhen)Co.,LTD, 2.2一次冲/ 钻孔One-time Hole-punching/drilling A、一次冲/ 钻孔主要冲管位孔和工艺孔，孔位和孔徑均要符合图纸要求； One-time hole-punching/drilling is mainly to punchorientation-hol
4、e and technical hole. The hole-position and hole-diameter must be consistent with drawing requirement. B、冲/钻板方向为从铜面到铝面，可有效避免铝面擦花； Punching/drilling direction is from Cu surface to Al surface,which can effectively avoid scratches of Al surface.,5,競華電子(深圳)有限公司,A+PCB Electorics(Shen Zhen)Co.,LTD, 2.3、图
5、形转移Image Transfer A、磨板Scrubbing a、为提高干膜和保护膜面的结合力，防止保护膜面干膜、脱落，可轻磨保护膜面； In order to improve the combination of dry film If etching was not well done, re-etch is needed quickly.,11,競華電子(深圳)有限公司,A+PCB Electorics(Shen Zhen)Co.,LTD, 2.7蚀刻检查Etching Check A、绝缘层上的任何地方都不允许用刀片来刮； Using knife to scratch any par
6、t of the insulated layer is not allowed. B、主要检查短路、缺口、开路，报废单元不能钻孔， 只能用黑油笔打“” ； Mainly check short circuit, gap, open circuit. Abandoned unit mustnt be drilled and can only be marked with “X” by black oil-pen.,12,競華電子(深圳)有限公司,A+PCB Electorics(Shen Zhen)Co.,LTD,2、8阻焊制作Solder Mask Making A、单面磨板（线路面），不允许
7、板面有氧化和胶渍现象； Single-side scrubbing (circuit side). Oxidation and glue stains on the board surface are not allowed. B、待板子冷却至室温后印阻焊 Print solder mask after the board is cooled into room temperature. C、待铝基板冷却至室温后，方可对位曝光； Register and expose aluminous PCB after it is cooled into room temperature. a 、对位前应
8、认真检查板面是否有感光油堆积及不均匀，如有且多则应及时返工； Before registration, it is necessary to seriously check if the sensitization oil accumulates on the board surface or is uneven. If there is a lot of sensitization oil on the board surface, it must re- process such boards in time. b 、对位时应注意菲林与板面MARK点的同心度； During registr
9、ation, it is necessary to pay attention to the concentricity of the film and mark point.,13,競華電子(深圳)有限公司,A+PCB Electorics(Shen Zhen)Co.,LTD,D、曝光：Exposing E、顯影：Developing F、檢查：重點檢查顯影不淨和綠肥油上焊盤； Check: Mainly check unclean developing and solder mask on the PAD. G、無特殊要求的板在顯影后須撕掉鋁面保護膜，鋁面不能有膠漬和保護膜殘留； It m
10、ust rip off the protective film on the Al surface after developing for unspecialized boards. Glue stains and protective film leftover on the Al surface are not allowed. 注：若有特殊要求，則在顯影后及全制程都不可撕掉鋁面保護膜； Remark: If the customer has special requirements, the protective film mustnt be ripped off after deve
11、loping even during the whole production. H 、返洗绿油板返洗绿油前不能撕掉铝面保护膜，并检查有无破损，如有必须用皱纹胶纸贴好。 The protective film cannot be ripped off before washing off solder mask for re-process and should be checked if is broken. If the protective film is broken, it must be mended with adhesive tape.,14,競華電子(深圳)有限公司,A+PC
12、B Electorics(Shen Zhen)Co.,LTD,如下工序为打定位孔工序必须先固化阻焊后在送板下工序。 2.9打定位孔Orientation-hole Punching A 、用层压打靶在做好的线路相应靶位图上打靶。 Punch orientation-hole at corresponding position of the board with finished circuits by layerpressing punching,15,競華電子(深圳)有限公司,A+PCB Electorics(Shen Zhen)Co.,LTD, 2.10字符制作(根据MI要求而定) Com
13、ponent Mark Making (based on the requirement of MI) A 、每印一块工作板后都需认真自检，合格后再继续印 刷，不合格板需分开及时返工； Conduct self-check for every printed working board and continue printing when the previous one is confirmed to be qualified. Unqualified boards must be separated from qualified ones and be re-processed in ti
14、me. B、字符不允许有模糊、重影、残缺、渗油等现象； Component mark mustnt be ambiguous, broken, oilseeped or with ghost image.,16,競華電子(深圳)有限公司,A+PCB Electorics(Shen Zhen)Co.,LTD, 2.11 喷锡HALS A、锡炉温度控制在*； The Tin-oven temperature is controlled within*. B、喷锡后要充分冷却后方可进行后处理； Conduct post-treating when the board is fully cooled
15、after HALS. C、后处理的热水洗段要将板面充分清洗干净，防止板 面哑色； Completely clean the board surface at the hot-water washing section of the post-treating to avoid dim color of the board surface.,17,競華電子(深圳)有限公司,A+PCB Electorics(Shen Zhen)Co.,LTD, 2.12 喷锡检查HALS Check A、锡面平整，无锡堆、锡高等现象； The Tin surface must be smooth without
16、 Tin-piling and high Tin. B 、所有焊点不允许有不上锡现象； Assure all solder points are covered with Tin. C 、MARK.一定要平整，不允許錫面凸出或錫面不均勻； All MARK points must be smooth. It is not allowed that the Tin surface is protruded or uneven. D、錫面顏色一致，光亮度要好，不允許有啞色； The color of Tin surface must be unified with good brightness and no dim color.,18,競華電子(深圳)有限公司,A+PCB Electorics(Shen Zhen)Co.,LTD, 2.13单面磨板（视客户要求而定） Single-side Scrubbing (according to customers requirements) A 、磨板前要彻底洗机、换水，水洗缸； Completely clean the machine and
