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1、 SMD常用术语微组装技术MPT/Microelectronic Packaging echnology混装技术Mixed Component Mounting Technology封装 Package贴片 Pick and Place拆焊 Desoldering再流Reflow浸焊 Dip Soldering拖焊 Drag soldering印制电路Printed Circuit印制线路 Printed Wiring印制电路板 printed circuit board印制线路板printed wiring board层压板laminate覆铜薄层压板copper-clad laminate
2、基材base material成品板production board印刷printing导电图形conductive pattern印制组件printed component单面印制板single-sided printed board双面印制板double-sided printed board多层印制板multilayer printed board电烙铁 Iron热风嘴 hot air reflowing noozle吸锡带soldering wick吸锡器tin extractor焊后检验post-soldering inspection目视检验visual inspection机器检
3、验 machine inspection焊点质量 soldering joint quality焊电缺陷 soldering jont defect错焊 solder wrong漏焊 solder skips虚焊 pseudo soldering冷焊 cold soldering桥焊 solder bridge脱焊 open soldering焊点剥离 solder off不润湿焊点 soldering nonwetting锡珠 solder ball拉尖 icicle ； solder projection孔洞 void焊料爬越 solder wicking过热焊点 overheated s
4、older connection不饱和焊点 insufficient solder connection过量焊点 excess solder connection微组装技术MPT/Microelectronic Packaging echnology混装技术Mixed Component Mounting Technology封装 Package贴片 Pick and Place拆焊 Desoldering再流Reflow浸焊 Dip Soldering拖焊 Drag soldering印制电路Printed Circuit印制线路 Printed Wiring印制电路板 printed ci
5、rcuit board印制线路板printed wiring board层压板laminate覆铜薄层压板copper-clad laminate基材base material成品板production board印刷printing导电图形conductive pattern印制组件printed component单面印制板single-sided printed board双面印制板double-sided printed board多层印制板multilayer printed board电烙铁 Iron热风嘴 hot air reflowing noozle吸锡带soldering
6、wick吸锡器tin extractor焊后检验post-soldering inspection目视检验visual inspection机器检验 machine inspection焊点质量 soldering joint quality焊电缺陷 soldering jont defect错焊 solder wrong漏焊 solder skips虚焊 pseudo soldering冷焊 cold soldering桥焊 solder bridge脱焊 open soldering焊点剥离 solder off不润湿焊点 soldering nonwetting锡珠 solder bal
7、l拉尖 icicle ； solder projection孔洞 void焊料爬越 solder wicking过热焊点 overheated solder connection不饱和焊点 insufficient solder connection过量焊点 excess solder connection助焊剂剩余 flux residue焊料裂纹 solder crazeing焊角翘起 fillet-lifting ；lift-offAI :Auto-Insertion 自动插件AQL :acceptable quality level 允收水平ATE :automatic test eq
8、uipment 自动测试ATM :atmosphere 气压BGA :ball grid array 球形矩阵CCD :charge coupled device 监视连接组件(摄影机)CLCC :Ceramic leadless chip carrier 陶瓷引脚载具COB :chip-on-board 芯片直接贴附在电路板上cps :centipoises(黏度单位) 百分之一CSB :chip scale ball grid array 芯片尺寸 BGACSP :chip scale package 芯片尺寸构装CTE :coefficient of thermal expansion
9、热膨胀系数DIP :dual in-line package 双内线包装(泛指手插组件)FPT :fine pitch technology 微间距技术FR-4 :flame-retardant substrate 玻璃纤维胶片(用来制作 PCB材质)IC :integrate circuit 集成电路IR :infra-red 红外线Kpa :kilopascals(压力单位)LCC :leadless chip carrier 引脚式芯片承载器MCM :multi-chip module 多层芯片模块MELF :metal electrode face 二极管MQFP :metalized
10、 QFP 金属四方扁平封装NEPCON :National Electronic Package andProduction Conference 国际电子包装及生产会议ppm:parts per million 指每百万 PAD(点)有多少个不良 PAD(点)psi :pounds/inch2 磅/英吋 2PWB :printed wiring board 电路板QFP :quad flat package 四边平坦封装SIP :single in-line packageSIR :surface insulation resistance 绝缘阻抗SMC :Surface Mount Co
11、mponent 表面黏着组件SMD :Surface Mount Device 表面黏着组件SMEMA :Surface Mount EquipmentManufacturers Association 表面黏着设备制造协会SMT :surface mount technology 表面黏着技术SOIC :small outline integrated circuitSOJ :small out-line j-leaded packageSOP :small out-line package 小外型封装SOT :small outline transistor 晶体管SPC :statist
12、ical process control 统计过程控制SSOP :shrink small outline package 收缩型小外形封装TAB :tape automaticed bonding 带状自动结合TCE :thermal coefficient of expansion 膨胀(因热)系数Tg :glass transition temperature 玻璃转换温度THD :Through hole device 须穿过洞之组件(贯穿孔)TQFP :tape quad flat package 带状四方平坦封装UV :ultraviolet 紫外线uBGA :micro BGA
13、微小球型矩阵cBGA :ceramic BGA 陶瓷球型矩阵PTH lated Thru Hole 导通孔IA Information Appliance 信息家电产品MESH 网目OXIDE 氧化物FLUX 助焊剂LGA (Land Grid Arry)封装技术 LGA 封装不需植球，适合轻薄短小产品应用。TCP (Tape Carrier Package)ACF Anisotropic Conductive Film 异方性导电胶膜制程Solder mask 防焊漆Soldering Iron 烙铁Solder balls 锡球Solder Splash 锡渣Solder Skips 漏焊
14、Through hole 贯穿孔Touch up 补焊Briding 穚接(短路)Solder Wires 焊锡线Solder Bars 锡棒Green Strength 未固化强度(红胶)Transter Pressure 转印压力(印刷)Screen Printing 刮刀式印刷Solder Powder 锡颗粒Wetteng ability 润湿能力Viscosity 黏度Solderability 焊锡性Applicability 使用性Flip chip 覆晶Depaneling Machine 组装电路板切割机Solder Recovery System 锡料回收再使用系统Wire
15、 Welder 主机板补线机X-Ray Multi-layer Inspection System X-Ray孔偏检查机BGA Open/Short X-Ray Inspection Machine BGA X-Ray检测机Prepreg Copper Foil Sheeter P.P. 铜箔裁切机Flex Circuit Connections 软性排线焊接机LCD Rework Station 液晶显示器修护机Battery Electro Welder 电池电极焊接机PCMCIA Card Welder PCMCIA卡连接器焊接Laser Diode 半导体雷射Ion Lasers 离子
16、雷射Nd: YAG Laser 石榴石雷射DPSS Lasers 半导体激发固态雷射Ultrafast Laser System 超快雷射系统MLCC Equipment 积层组件生产设备Green Tape Caster, Coater 薄带成型机ISO Static Laminator 积层组件均压机Green Tape Cutter 组件切割机Chip Terminator 积层组件端银机MLCC Tester 积层电容测试机Components Vision Inspection System芯片组件外观检查机高压恒温恒湿寿命测试机 High Voltage Burn-In Life Tester电容漏电流寿命测试机 Capacitor Life Test with Leakage Current芯片打带包装机 Taping Machine组件表面黏
