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1、M. Chbat, S. Eberlin, M. Tochtermann, T. Juhnke,hiT 7500 Multi-Haul DWDM system Product Reliability Update Processes, Status, and Measures,Sept 15, 2004,Siemens Reliability Process Overview,Card FIT Rate,Feedback from Field Return Rate,Product Reliability Assurance Process,Reference : Siemens standa
2、rd; in agreement with international standards IEC 61709,product definition,product development,product delivered,requirements aligned with technology basis failure rate allocation to individual cards involvement of component engineering 1 FIT = 1 Failure per 109h)!,Bathtub Curve,IEC 61709: Electroni
3、c components Reliability Reference conditions for failure rates and stress models for conversion (no basic failure rates),Relationship between StandardsSIEMENS standard SN29500 / IEC61709 compared to SR-332,SR-332: Reliability Prediction Procedure for Electronic Equipment,SN29500: Failure rates of c
4、omponents Expected values (This is in addition to IEC 61709),a) Climatic and mechanical stresses per IEC 721-3-3 (see next slide)multiplying factors for environmentalconditions b) Quality factor tested components SN725004 quality levels known c) Temperature and electrical stress by reference conditi
5、ons IEC 61709given reference conditions and conversion (SR-332),IEC 61709: Electronic components Reliability Reference conditions for failure rates and stress models for conversion,The definitions, reference conditions and conversion models used in the IEC 61709 fully correspond with the already exi
6、sting SIEMENS standard SN 29500 method.,Details: SIEMENS Standard SN29500 and IEC61709,FIT Rates of Individual Electrical Components (1),Voltage dependence and Current dependence,UOperating voltage in V UrefReference voltage in V UmaxRated voltage in V C1Constant in (1/V)C2 C2,C3Constants (1).Digita
7、l CMOS Families, Contactors (2).Others,IOperating current in A IrefReference current in A ImaxRated current in A C4,C5Constants,FIT Rates of Individual Electrical Components (2),AConstant Ea1,Ea2Activation energies in eV TU,refReference ambient temperature in K T1Reference junction*)- (comp.*)-) tem
8、perature in K T2Actual junction*)- (comp.*)-) temperature in K *) Depends on type of component, see also SN 29500, Part 1, Capt. 4.3,Temperature dependence,The expected failure rate of a HW-unit can be calculated by adding the expected failure rates of the components :,Details: Total Reliability and
9、 Total Failure Rate of Unit,Siemens Reliability Process Overview,Card FIT Rate,Feedback from Field Return Rate,Estimation of FIT Rates for Optical Components,In parallel to the qualification cross-check detailed discussions take place with the vendor What is the estimate of the vendor? How did he re
10、ach his estimate ? What is the FIT rate of sub-components and PCBAs of the module ? Results of the cross-qualification are taken into account (failures, corrective actions, changes) The estimation of the vendor and the expertise of qualification team lead to the Siemens estimate (not necessarily the
11、 same as the vendors estimate) Field returns are taken into account when available and compared to the estimate FIT rates are adapted accordingly (repetitive process),Example of FIT Rate Adaption: EDFA w/ 5 pumps,First estimate in 2001: 6000 FIT (complete new design incl. new Pumps, no experience at
12、 SIEMENS side) New vendors (new spec.) were qualified by CoC Optics and the CoC process took place Estimates by two vendors: 3500 - 4800 FIT Reduction to 5000 FIT beginning of 2004 Quality improvement discussions with the vendors ongoing Check with field returns: 1600 FIT Reduction to 4000 FIT(Sieme
13、ns estimate) in April of 2004 Continuously monitored Similar process with EDFAs (2 pumps) lead to an estimate of 2400 FIT,Example of FIT Rate Calculation for an Optical Amplifier Provided by the EDFA Supplier (1),Example of FIT Rate Calculation for an Optical Amplifier Provided by the EDFA Supplier
14、(2),Overall FIT rate: 3457.7,Siemens Reliability Process Overview,Card FIT Rate,Feedback from Field Return Rate,Reference FIT Rate for electrical and mechanical components,SN 29500 developed by ZT SR Corporate Function Standardization and Regulation, Cross-functional expert team SN 29500, Committee
15、Quality Used by all Siemens divisions Updated by expert team with data from: field experience, component qualifying teams and component manufacturers,History and acceptance Developed as companys internal standard First edition in 1978 Worldwide used by the most Siemens groups Widely used outside the
16、 company Generally used calculating the Siemens telecommunications systems Approved worldwide by the customers Fully in accordance with EN/IEC 61709,actually parts Part1:General Part2:integrated circuits Part3:discrete semiconductors Part4:passive components Part5:electrical connections Part6:connectors and sockets Part7:relays Part9:switches Part10:signal and pilote lamps Part11:contactors Part12:optical semiconductors, signal receivers
