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1、此资料由网络收集而来，如有侵权请告知上传者立即删除。资料共分享，我们负责传递知识。面试英文版自我介绍面试英文版自我介绍面试英文版自我介绍(一)Good morning. I am very glad to be here for this interview.First let me introduce myself. My name is , and my English name is . Ive finished my undergraduate education in XXXXX University, Majoring in Electronic Science and Techn
2、ology in the college of Technical Physics.I am open-minded, willing and have broad interests like basketball, reading and especially in engineering such as software programming, website design, hardware design. For example, during the past four years, I have accomplished two websites: one is the web
3、site of our school, and the other is the website of the doctor forum of china 2007. Furthermore, I am interested in C plus plus programming language and have written some application programs. In July in the last year,I finished my graduate project with flying colors,which was a software application
4、 about Image Process . In addition, I have also finished some projects about embedded system by using MCU when I was a junior.Although I have broad interests in many aspects and grasp the essential knowledge of the major, but I think at present, I can do many things in a superficial level, but not b
5、e competent to do things professionally owing to lack of ample knowledge and ability. So I think further study is still urgent for me to realize self-value.The major that I hope pursue for my further education is IC design. Because I find integrated circuits are playing a more and more important rol
6、e in our modern society. And nowadays in China, with the recognition by the government, our domestic integrated circuits industry is growing rapidly and that may provide a lot of chances to us.I plan to concentrate on study and research in this field in my graduate time. And I hope I can form a syst
7、ematic view of micro electronics and IC design technology and make a solid foundation for future profession after three years study here.OK, thats all. Thank you very much面试英文版自我介绍(二)good morning, my name is jack, it is really a great honor to have this opportunity for a interview, i would like to a
8、nswer whatever you may raise, and i hope i can make a good performance today, eventually enroll in this prestigious university in september.now i will introduce myself briefly,i am 21 years old,born in heilongjiang province ,northeast of china,and i am curruently a senior student at beijing XX uni.m
9、y major is packaging engineering.and i will receive my bachelor degree after my graduation in june.in the past 4 years,i spend most of my time on study,i have passed CET4/6 with a ease.and i have acquired basic knowledge of packaging and publishing both in theory and in practice. besides, i have att
10、end several packaging exhibition hold in Beijing, this is our advantage study here, i have taken a tour to some big factory and company.through these i have a deeply understanding of domestic packaging industry. compared to developed countries such as us, unfortunately, although we have made extraordinary progress since 1978,our packaging industry are still underdeveloped, mess, unstable, the situation of employees in this field are awkard.but i have full confidence in a bright future if only our economy can keep the growth pace still.5
