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1、CMLT Ball Size & Gold Remain Issue- Smaller capillary CDATS WB Process,Die source : Chi-Mei 14 x 17mil chip Pad Opening : P Pad 94um, N Pad 92um Bonding Method : BSOB 2 wires Device : 3020 18 columns x 8 rows Ball shear spec : 42g Ball size spec : Max 85um Gold remain spec : 50% Gold Wire : K&S AW99
2、 1mil (EL 2-7% BL 9g) Capillary : GAISER 1551-13-437GM 65(6x120D-8D-10) (CD:2.5mil (63.5um) Tip:6.5mil Hole:1.3mil),Material Background & Spec,P Pad,N Pad,Machine type : Harrier S/N TE019-052 Software version:,Material Background,Parameter Setting,Scrub only applied to P Pad,Data,P Pad ball size & t
3、hickness P Pad Ball Shear (g),N Pad ball size & thickness N Pad Ball Shear (g),Result photo,Best P Pad,Best N Pad,Worst P Pad,Worst N Pad,After Shear Gold Remain,100%,P pad,P pad,N pad,N pad,70%,90%,80%,Summary Result,With smaller CD capillary, smaller ball size can be achieved Enhancer F2 increased to 28 (was 20) Scrub T1 & Amplitude also increased Both P & N pads able to achieve 50% gold remain,
