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1、 一TFT工艺流程中英文标准名称Array Process Flow阵列段工艺流程Input投料Unpacking拆包装Initial clean预备清洗Particle count尘埃粒子测试Gate栅电极层Clean before depo成膜前清洗Gate （Mo/Al alloy ) Film depo栅电极成膜RS meter电阻测量Macro Inspection宏观检查Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry(VCD)光刻胶低压干燥PR soft bake前烘Expose曝光Titler Expose/E
2、dge Expose打标/边缘曝光Develop显影PR hard bake坚膜ADI 显影后自动光学检查Mic/Mac Inspection宏微观检查CD after develop显影后关键尺寸检查Total pitch长寸测量Gate Wet etch栅电极湿刻Contact angle接触角测量PR strip光刻胶剥离CD after etch刻蚀后关键尺寸测量AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查Laser Repair激光修补Active层Clean before depo成膜前清洗Active film depoActive成膜AOI自动
3、光学检查Macro Inspection宏观检查Thickness Measurement厚度测量Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压干燥PR soft bake前烘Expose曝光Develop显影PR hard bake坚膜ADI显影后自动光学检查Mic/Mac Inspection宏微观检查Active film Dry etch & AshingActive膜干刻与灰化Thickness Measurement厚度测量PR strip光刻胶剥离AEI刻蚀后自动光学检查Mic/Macro Inspe
4、ction宏微观检查S/D源/漏电极层Clean before depo成膜前清洗S/D Mo film depo源/漏电极成膜RS meter电阻测量MACRO Inspection宏观检查Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压干燥PR soft bake前烘Expose曝光Edge expose边缘曝光Develop显影PR hard bake坚膜ADI 显影后自动光学检查MIC/MAC Inspection宏微观检查CD after develop显影后关键尺寸检查Hard bake by oven烘
5、炉坚膜S/D Mo Wet etch源电极/漏电极湿刻n+ a-Si Dry etchn+高掺杂膜干刻PR strip光刻胶剥离Thickness Measurement厚度测量CD after etch刻蚀后关键尺寸测量AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查Clean before O/S test短路/开路测试前清洗Open/Short Test短路/开路测试Passivation保护层Clean before depo成膜前清洗Passn film depo保护膜成膜AOI自动光学检查MACRO Inspection宏观检查Thickness Me
6、asurement厚度测量Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压干燥PR soft bake前烘Expose曝光Edge expose边缘曝光Develop显影PR hard bake坚膜ADI显影后自动光学检查Micro/Macro Inspection宏微观检查SinX Dry etch & ASHING氮化硅干刻与灰化PR strip光刻胶剥离AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查ITOITO层Clean before PR成膜前清洗a-ITO film dep
7、oITO成膜RS meter电阻测试Anneal煺火Macro Inspection宏观检查Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压干燥PR soft bake前烘Expose曝光Develop显影PR hard bake坚膜ADI显影后自动光学检查Micro/Macro Inspection宏微观检查ITO film etchITO膜湿刻PR strip光刻胶剥离AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查Final E/T最终电测Anneal煺火Array test阵列测
8、试Array repair阵列修补TEG testTEG测试Sort分级Cell Process flow制盒段工艺流程CF Input彩膜投料CF Initial Clean彩膜预备清洗CF AOI彩膜自动光学检查CF Sort彩膜分级PI配向膜Clean before PI 配向膜涂布前清洗PI Print配向膜涂布Pre-cure预固化PI Inspection配向膜检查PI Thickness Measurement配向膜厚度测量Main-cure固化PI rework配向膜返工ODFCF&TFT MatchingCF&TFT匹配Rubbing配向摩擦Rubbing Inspectio
9、n摩擦检查Loader & Un loader上料机/下料机Buffer缓冲器CST Buffer工装栏缓冲器Rotation/Cooling Unit旋转/冷却单元Turn Align Unit旋转/对位单元Turn Over Unit翻转单元After Rubbing Cleaner摩擦后清洗Spacer Spray衬垫球散布Spacer Counter衬垫球计数Spacer rework衬垫球返工Spacer Cure衬垫球附着固化Short Dispense导电胶涂布Sealant Dispense边框胶涂布Seal Inspection边框胶检查LC Dispense液晶滴下Vacu
10、um Assembly真空贴合UV Cure紫外线固化Mis-alignment check错位检查Seal Oven边框胶热固化Eye Inspection目视检查Cell gap Measurement盒厚测试Cutting切割1/4(1/6)Sheet Cutting,1/4(1/6)切割Stick Cutting,切条Cell Cutting切粒Visual TestVisual 测试ECPEdge Grind磨边Dipping clean浸泡式清洗Clean before Pol 贴片前清洗Pol Attach贴片Pol Inspection贴片检查Pol rework贴片返工Aut
11、o ClaveAuto Clave消泡Laser TrimmerLaser Trimmer激光切线Test测试Gross Test终检Repair修补Bin sorter分级OQC Test出货检查Store货栈Module Process Flow模块段工艺流程COGPad cleaning端子清洗IC BondingIC 邦定Microscope InspectionAOI 镜检自动光学检查Adhesive test粘接力测试FOGACF AttachingACF 粘贴FOG BondingFOG 邦定Microscope Inspection镜检Peeling strength test
12、拉力测试ET test1电测1IC or FPC Repair修补UV glue sealing 封胶FPC reinforcement补强UV glue curingUV胶固化Assembly组装ET test2电测2anti-ultraviolet tape attaching遮光胶带粘贴protected tape attaching保护胶带粘贴Backlight assembly背光源组装Backlight soldering背光源焊接Touch panel assembly触摸屏组装Final ET test最终电测Rework返工Aging老化QC testQC检验Code pri
13、nting喷码Packing包装OQC Test出货检验Finished good shipment合格品出货CIM name集成控制系统名称CIM计算机集成制造系统CIM System计算机集成制造系统Manufacturing Execution System(MES)制造执行系统（MES）Preventive Maintenance System(PMS)设备预防保养系统（PMS）Statistical Process Control(SPC)统计过程管理（SPC）Equipment Automation Program(EAP)设备自动化（EAP）Report报表Engineering Data Analysis(EDA)工程数据分析（EDA）Finished Good Management System(FGMS)成品管理系统（FGMS）Product产品Glass玻璃基板Panel面板Process Flow工艺流程Operation操作EDC工程
