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1、 CCM产品工艺知识培训 制作 陈建文日期 2011 8 20 2 产品的应用产品的类型产品的构造产品的制作工艺问与答附录 专业名词介绍 3 PartI产品的应用 4 PartI产品的应用 拆解 拆解 手机摄像模组 5 PartII产品的类型 软板定焦模式 FF 1 B To B2 GoldFinger 6 PartII产品的类型 软板变焦模式1 手动变焦 MF 2 自动变焦 AF 7 PartII产品的类型 插槽模式 Socket 8 PartII产品的类型 像素分类CIF 352 288 10万像素 0 1M VGA 640 480 30万像素 0 3M SXGA 1280 1024 13
2、0万像素 1 3M UXGA 1600 1200 200万像素 2 0M 9 PartIII产品的构造 CSP ChipScalePackage 10 PartIII产品的构造 COB ChipOnBoard 11 PartIII产品的构造 镜头 Lens 镜座 Holder 芯片 Chip 电路板 PCB 连接器 Con 12 PartIII产品的构造 FPC 13 PartIV产品的制作工艺 材料1 晶圆 Wafer 主要是由硅和锗组成 是摄像头模组的核心部分 称之为影像传感器 14 PartIV产品的制作工艺 2 线路板PrintedCircuitBoard印刷电路板 是电子元器件的支撑
3、体 是电子元器件电气连接的提供者 简称PCB 15 PartIV产品的制作工艺 3 镜座 Holder 16 PartIV产品的制作工艺 4 镜头 Lens 17 PartIV产品的制作工艺 5 软板 FPC FlexibleCircuitBoard软性印制电路是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性绝佳的可挠性印刷电路 18 PartIV产品的制作工艺 工艺流程 Wafer清洗 Plasma清洗 固晶 固晶烘烤 邦线 金线检查 DAM邦定 DAM烘烤 二流体清洗 CCD检查 Glass贴附 CCD检查 固化 半成品测试 19 dispense CMOSChip dispense
4、IRGlass dispense LensBarrel 20 PartIV产品的制作工艺 DieBonding 使芯片与PCB粘合 注意点 1 芯片方向2 胶量3 顶针和吸嘴印4 芯片角度5 芯片位置6 芯片倾斜 21 PartIV产品的制作工艺 WireBonding 通过金线焊接使芯片与PCB线路导通 注意点 1 接线是否正确2 线弧3 金球大小4 金球厚度5 金线拉力6 金球推力 22 SolderPaste ScreenPrint PassivePlacement ForDieAttach Passive SolderPaste Passive Substrate 23 DieAtta
5、ch WireBonding WetClean Chip SensorArea AuWire Chip SensorArea AuWire 24 IRGlassMount IRGlassSAW WaferRing IRGlass IRGlass 25 GlueDispense IRGlassAttach Holder Holder Glue Glue IRcutGlass IRGlass CA800 IR CA800 IR 26 GlueDispense HolderAttach Glue Glue BarrelInsert Barrel Holder CA800 HA CA800 HA CA
6、 800 BI 27 Singlation cut cut 28 Focusadjust Barrel BarrelFixation Motor Lighting PercolationMethod chart AchromaticLens ND4 AdjustmentofLightQuantity Laser 29 PartV问与答 Q A 30 PartVI专业名词介绍 31 ENDThanks 32 BondingProcess 33 pad lead Freeairballiscapturedinthechamfer 34 pad lead Freeairballiscapturedi
7、nthechamfer SEARCHHEIGHT 35 pad lead Freeairballiscapturedinthechamfer SEARCHSPEED1 SEARCHTOL1 36 Freeairballiscapturedinthechamfer pad lead SEARCHSPEED1 SEARCHTOL1 37 Freeairballiscapturedinthechamfer pad lead SEARCHTOL1 SEARCHSPEED1 38 Freeairballiscapturedinthechamfer pad lead SEARCHTOL1 SEARCHSP
8、EED1 39 Freeairballiscapturedinthechamfer pad lead SEARCHTOL1 SEARCHSPEED1 40 Formationofafirstbond pad lead SEARCHSPEED1 SEARCHTOL1 41 Formationofafirstbond pad lead SEARCHSPEED1 SEARCHTOL1 IMPACTFORCE 42 FormationofafirstbondContact pad lead heat PRESSURE UltraSonicVibration 43 Formationofafirstbo
9、ndBase pad lead UltraSonicVibration heat PRESSURE 44 Capillaryrisestoloopheightposition pad lead 45 Capillaryrisestoloopheightposition pad lead 46 Capillaryrisestoloopheightposition pad lead 47 Capillaryrisestoloopheightposition pad lead 48 Capillaryrisestoloopheightposition pad lead 49 Capillaryris
10、estoloopheightposition pad lead RH 50 Formationofaloop pad lead RD ReverseDistance 51 Formationofaloop pad lead 52 pad lead 53 pad lead CalculatedWireLength WIRECLAMP CLOSE 54 pad lead CalculatedWireLength 55 pad lead SEARCHDELAY 56 pad lead TRAJECTORY 57 pad lead TRAJECTORY 58 pad lead TRAJECTORY 5
11、9 pad lead TRAJECTORY 60 pad lead TRAJECTORY 61 pad lead TRAJECTORY 62 pad lead TRAJECTORY 63 pad lead TRAJECTORY 64 pad lead TRAJECTORY 65 pad lead TRAJECTORY 66 pad lead 2ndSearchHeight SearchSpeed2 SearchTol2 67 pad lead SearchSpeed2 SearchTol2 68 pad lead SearchSpeed2 SearchTol2 69 Formationofas
12、econdbond pad lead heat 70 FormationofasecondbondContact pad lead heat heat 71 pad lead heat heat FormationofasecondbondBase 72 pad lead 73 pad lead 74 pad lead 75 pad lead Taillength 76 pad lead 77 pad lead 78 pad lead Disconnectionofthetail 79 pad lead Disconnectionofthetail 80 pad lead Formationofanewfreeairball
