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1、Overview KLABasicOperation 1 21xxCapabilities 2 3 RunOverview 4 Runonewafer InspectionQueue 5 6 7 8 9 StoppingtheInspection 10 DefectOverview Whymonitordefects Toimproveproductionyields defectsneedtobemonitoredandstatisticallyanalyzedateachstageofwaferproduction 11 DefectSort 1 False Foundnothingaft
2、erreviewwithinspectiondata 2 Unkown Defectswerefoundbutthereisnosuitabledefectcodetoassign 3 Fallonparticle Particleonsurfaceofpatten 4 Infilmparticle Particlewascontainedinfilm suchaspoly HDP metalandsoon HDP Poly 12 5 Scratch Especiallyforscratchcausedbyrobot othertoolpartsorman made Defectmap Def
3、ectiamge Micro Macro 13 6 Discolor Colordifference 7 Masking Shouldbeetchedbutstillremian poly SiN spacer metalandsoon Someconnectmorethantwolines it sbridge killer 14 8 Ringlikedefect SuchasdefectscausedbyARCsplash usuallyrelatedtoPHOTO Poly Metal 9 Grapelikedefect InducesbyPHOTOPU 15 10 Residue Al
4、wayshappenafterwetstationclean 11 Pattenabnormal Roughness Defocus Pattenshiftandsoon Roughness Defocus Pattenshift PattenAbnormal 16 12 Concave COP Crystalorientedpits OxideLoss Pits 13 Peeling Patternshiftormissing Wplugisoneofpeeling alwaysappearatwaferedge 17 14 Blind CTorViahavenotbeenopened 15
5、 Pattendamage Metaldamage Polybrokenispattendamagetoo alwayshappenduringHighImp 18 16 WResidue 1 CausedbyOxideLoss 2 CausedbyCMP NORMALABNORMAL 17 Under Pat Underlayerpatternfailissue 19 18 Salicide abnormal Salicidepoorformation 19 Grain Includingpolyormetalgrain 20 20 Slurry 21 PR Polymer remain PRhasnotbeenstrippedcompletely typicallycontainsCarbon 21 22 Arcing 23 Lineopen 22 24 Corrosion Causedbyetchstripchamberorbadenvironment Thistypedefectis100 killerdefect 23 EndThankYou 24
