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1、精品资料网（http:/）25万份精华管理资料，2万多集管理视频讲座三、电 子 组 装（Assembly） IPC-T-50F Terms and Definition for Interconnecting and Packaging Electronic Circuits电子电路互连与封装的定义和术语 IPC-S-100 Standards and Specifications Manual标准和详细说明汇编手册 IPC-E-500 IPC Electronic Document Collection已出版的IPC标准电子文档资料合订本 IPC-TM-650 Test Methods Ma
2、nual试验方法手册 IPC-ESD-20-20 Association Standard for the Development of an ESD Control Program静电释放控制过程(由静电释放协会制定) IPC/EIA J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies电气与电子组装件锡焊要求 IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001Includes Amendment 1J-STD-001辅助手册及指南及修改说明1
3、 IPC-A-610C Acceptability of Electronic Assemblies印制板组装件验收条件 IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C ComparisonIPC-610手册和指南(包括IPC-A-610B和C的对比) IPC-EA-100-K Electronic Assembly Reference Set电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。 IPC/WHMA-A-620 Requireme
4、nts and Acceptance for Cable and Wire Harness Assemblies电缆和引线贴装的要求和验收 IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology倒装芯片及芯片级封装技术的应用 IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation芯片直装技术实施导则 IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Appli
5、cations倒装芯片用半导体设计标准 J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size ConfigurationsFC（倒装片）和CSP(芯片级封装)的外形轮廓标准 IPC/EIA J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒装芯片及芯片级凸块结构的性能标准 SMC-WP-003 Chip Mounting Technology 芯片贴装技术 J-STD-013 Implementatio
6、n of Ball Grid Array and Other High Density Technology球栅阵列 (BGA)及其它高密度封装技术的应用 IPC-7095 Design and Assembly Process Implementation for BGAs球栅阵列的设计与组装过程的实施 IPC/EIA J-STD-032 Performance Standard for Ball Grid Array BallsBGA球形凸点的标准规范 IT-98000 JPL Chip Scale Packaging GuidelinesJPL 发布的CSP导则注： IT (The Ca
7、lifornia Institute of Technology) JPL (The Jet Propulsion Laboratory) IT-98080 JPL Ball Grid Array Packaging GuidelinesJPL 发布的BGA封装导则 IT-98093 ITRI Chip Carrier, Phase 1 ReportITRI 关于芯片载体的报告ITRI (The Interconnect Technology Research Institute) IPC-MC-790 Guidelines for Multichip Module Technology Ut
8、ilization多芯片组件技术应用导则 IPC-M-108 Cleaning Guides and Handbook Manual 清洗导则和手册 IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us?电路板离子洁净度测量：它告诉我们什么？ IPC-CH-65A Guidelines for Cleaning of Printed Boards & Assemblies印制板及组装件清洗导则 IPC-SC-60A Post Solder Solvent Cleaning Handbook 锡
9、焊后溶剂清洗手册 IPC-SA-61 Post Solder Semi-aqueous Cleaning Handbook 锡焊后半水溶剂清洗手册 IPC-AC-62A Aqueous Post Solder Cleaning Handbook 锡焊后水溶液清洗手册 IPC-TR-476A Electrochemical Migration: Electrically Induced Failures in Printed Circuit Assemblies 电化学迁移：印制电路组件的电气诱发故障 IPC-TR-580 Cleaning and Cleanliness Test Progra
10、m Phase 1 Test Results清洗及清洁度试验计划1阶段试验结果 IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 -Low Solids, Fluxes and Pastes Processed in Ambient Air IPC第3阶段非清洗助焊剂研究 IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing 深入离子洁净度测试 IPC-9201 Surface Insulation Resistance Handbook 表面绝缘电阻手册 IP
11、C-TP-104K Cleaning & Cleanliness Test Program, Phase 3 Water Soluble Fluxes,Part 1 & Part 2第3阶段水溶性助焊剂清洗，第一和第二部分 IPC-M-109 Component Handling Manual 元件处理手册 IPC/JEDEC J-STD-020B Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 非密封固态表面贴装器件湿度再流焊敏感度分类 IPC/JEDEC
12、 J-STD-033A Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用 IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非气密封装电子元件用声波显微镜 IPC-9500-K Set of four documents 9501-9504 9501至9504手册合订本 IPC-DRM
13、-18F Component Identification Desk Reference Manual 零件分类标识手册 IPC-DRM-SMT-C Surface Mount Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册 IPC-DRM-40E Through-Hole Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册 IPC-DRM-56 Wire Preparation & Crimping Desk Reference Manual导线和端子预成形参考手册 I
14、PC-DRM-53 Introduction to Electronics Assembly Desk Reference Manual电子组装基础介绍手册 IPC-M-103 Standards for Surface Mount Assemblies Manual 所有SMT标准合订本 IPC-M-104 Standards for Printed Board Assembly Manual 10种常用印制板组装标准合订本 IPC-TA-722 Technology Assessment of Soldering 锡焊技术精选手册 IPC-TA-723 Technology Assessm
15、ent Handbook on Surface Mounting表面安装技术精选手册 IPC-TA-724 Technology Assessment Series on Clean Rooms 清洁室技术精选系列 IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting以表面安装为主的元件封装及互连导则 IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments表面安装焊接件加速可靠性试验导则 IPC-PD-335 Electronic Packaging Handbook 电子封装手册 IPC-7525 Stencil Design Guidelines 网版设计导则 IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study IPC第3阶段受控气氛焊接研究 IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收检验手册
