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1、等离子技术讲座 等离子原理及其应用PLASMATRAININGPROGRAM 目录Agenda 等离子技术在高级封装工业的应用ApplicationofPlasmaTechnologyinAdvancedPackagingIndustries 等离子技术简介IntroductiontoPlasmaTechnologyMarch公司产品介绍ProductsofMarchPlasmaSystems 等离子技术在高级封装工业的应用PlasmaApplicationinAdvancedPackagingIndustries 综述Overview 微电子工业MicroelectronicIndustry
2、Flash EEPROMDRAM SRAMAnalog LinearMicrocontrollers Microprocessors MicroperipheralsASIC光电子工业OptoelectronicIndustryLaserDiodesFiberAssemblyHermeticPackagingMEMS印刷电路工业PrintedCircuitIndustryPrintedCircuitBoard 集成电路封装面临的挑战ICAssemblyandPackaging SpecificChallenges 不良的芯片粘结PoorDieAttachInsufficientHeatDiss
3、ipationDuetoPoorDieAttach不良的导线连接强度PoorWireBondStrengthContaminationonBondPad覆晶填料FlipChipUnderfillFilletHeightofUnderfillVoidinFlipChipUnderfill剥离DelaminationLaminateMaterialsReleasingMoistureMetalLeadframeOxidation印刷电路板孔中的残余物SmearinginPrintedCircuitBoards打印记号Marking 等离子体应用PlasmaApplications 表面污染物去除C
4、ontaminationRemovalWireBondingEncapsulationBallAttach ContaminationSources Fluorine NickelHydroxide Photoresist EpoxyPaste OrganicSolventResidue smearinPCB andscum 表面活化SurfaceActivationDieAttachEncapsulationFlipChipUnderfillMarking表面改性和刻蚀SurfaceModificationandEtchFluxlessSolderingCladdinglayerremova
5、lonfiber 表面活化 芯片粘结SurfaceActivation DieAttach ProperDieAttachCriticalHeatDissipationDelaminationPlasmaTreatmentofSubstratePriortoDieAttachPromotesAdhesionofEpoxyRemovesOxidationForGoodSolderReflowBetterBondBetweenDieandSubstrateBetterHeatDissipationMinimizesDelamination 污染物去除 导线连接ContaminationRemova
6、l WireBonding PoorWireBondStrengthContaminationOxidationSmallerBondPadPitches80mmto25mmHigherRatioofContaminationtoPadandWireDeformationWeldingInhibitedByPhysicalProcess ContaminantsActAsPhysicalBarrierChemicalProcess ContaminantsFormBondsWithSurfacesandMinimizeAdhesionEpoxyResinBleedout 污染物去除 导线连接C
7、ontaminationRemoval WireBonding PlasmaProcessingRemovesTraceContaminationandOxidationFromSubstratesMetalCeramicPlasticWireBondStrengthSignificantlyIncreasedThroughputIncreased LowerPressureRequired 污染物去除和表面活化 封装ContaminationRemovalandSurfaceActivation Encapsulation MoldingCompoundMustAdhereToDiffere
8、ntCompoundsSubstrateMaterialSolderMaskDieMetalBondPadsSeveralMaterialsBondingtoOneAnotherDelaminationCanResultFromPoorSurfaceActivityandContamination DelaminationBiggestChallengeForOrganicBasedSubstratesLaminateMaterialsAbsorbWaterFromAirandtheFluxResidueRemovalProcessTrappedMoistureReleasedFromHigh
9、Temperatures UseorSolderingOxidationonMetalLeadframesCanInhibitAdhesionofFrametoMoldPlasmaTreatmentofBGAPackages OtherPolymerSubstrates andMetalLeadframesImprovesSurfaceActivityAchievesGoodAdhesionMinimizesDelamination 污染物去除和表面活化 封装ContaminationRemovalandSurfaceActivation Encapsulation 表面活化 填料Surfac
10、eActivation Underfill UnderfillRequiredinFlipChipMinimizeThermalCoefficientofExpansion CTE MismatchBetweenDieandSubstrateChallengeVoidFreeWickingSpeedDifficultwithLargeDiesandHighDensityBallPlacementPlasmaTreatmentIncreasesSurfaceEnergyPromotesAdhesionIncreasingWickingSpeedsDecreasedVoiding Presence
11、ofOxidesInhibitsWireBondingLimitsGoodDieAttachmentInhibitsSolderReflowPlasmaTreatmentReducesMetalOxidesImprovesWireBondStrengthImprovesDieAttachmentImprovesSolderReflow 氧化物去除OxidesRemoval 印刷线路板上的残余物清除DesmearinginPCB SmearinginPrintedCircuitBoards PCB ViasMechanicallyorLaserDrilledLaminateMaterial Ep
12、oxyResin IsSmearedOverEdgesOfInnerMetalConductorLinesSubsequentPlatingOfTheViasMustElectricallyConnectAllTheConductorLinesSmearedResinMustBeRemovedToEnsureGoodElectricalContactPlasmaTreatmentRemovestheEpoxyResinsProducingCarbonDioxideandWater 集成电路封装中等离子工艺的应用ICAssemblyandPackaging PlasmaSolutions Imp
13、rovesDieAttachImprovedWireBondStrengthWithMinimalProcessRequirementsEffectiveEncapsulationofMetalandOrganicBasedPackagesMinimizesVoidsinFlipChipUnderfillDesmearinginPrintedCircuitBoards 等离子工艺的其它应用OtherPlasmaApplications SurfaceActivationofNumerousMaterials Polymers andMetals材料表面的活化ThinFilmEtch Al Si
14、 SiO2 Si3N4 W WSixOrganicRemoval去除有机污染物OxideRemoval去除氧化物ResidualFluorineRemoval去除氟的残物HydrophilationHydrophobationPlasmapolymerizationPECVD 关键参数CriticalProductParameters ProductType处理方式Metalvs LaminateChemicalSensitivityTemperatureSensitivityProductHandling产品放置MagazineSingleStripProcessRequired工艺的要求C
15、ontaminationRemovalSurfaceActivationThroughput产量的要求Uniformity均匀性要求 等离子工艺参数ParametersForPlasmaProcessing PowerSupplyFrequencyandPower电源的功率和频率ChamberandElectrodeConfiguration腔体的结构Pressure气压GasandConcentration工艺气体的选择Time处理的时间PumpingSpeed真空泵的速度ProductPositioning产品的位置ParametersFunctionofProductType 单一工艺不
16、适合所有的应用SingleProcessWillNotWorkForAllApplications等离子技术及集成电路封装工艺的知识是成功应用的关键KnowledgeOfICPackageandPlasmaTechnologyCriticalForSuccessfulApplicationMARCH拥有等离子应用的专家解决你的问题MarchMaintainsExpertsTrainedInPlasmaTechnologyToSolveYourProblem March 等离子技术PlasmaTechnology 等离子体简述Plasma What Why How 什么是等离子体What GasPhaseMixtureConsistsof Neutral PhysicallyActiveandChemicallyReactiveSpecies如何工作How ByPhysicalBombardmentandChemicalReactiontoRemoveContaminationActivateSurfaceEtch为什么要用等离子体技术Why ImprovesYieldsandEnhan
