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1、Prepared by Bin LiuPrepared by Bin Liu Date 8 3 2007Date 8 3 2007 HDIHDI制作制作 镭射钻孔镭射钻孔 培训教材培训教材 PDF created with pdfFactory trial version P 2 目录目录 前言前言 HDI工艺的发展趋势工艺的发展趋势 HDI产品类型产品类型 Laser钻孔简介钻孔简介 HDI制作常见问题及解决方法制作常见问题及解决方法 LASER钻机介绍钻机介绍 Microvia制作工艺制作工艺 Microvia 常见缺陷分析常见缺陷分析 PDF created with pdfFactor
2、y trial version P 3 随着电子产业的 轻 薄 短 小 及多功能化的发展 特 别是半导体芯片的高集成化与I O 输入 输出 数的迅速增加 孕育出了具有高密度 高精度 高可靠及低成本要求的 适应 高密度互联结构的新型PCB产品 HDI 随着PCB向微型和高密度互连的方向发展 越来越多制板采 用微导孔的连接方式实现高密度互连 而目前制作微导孔的主 要方法是laser drill 前言前言 PDF created with pdfFactory trial version P 4 HDI工艺简介工艺简介 PDF created with pdfFactory trial versio
3、n P 5 高密度互联多层板具有以下基本特征 微导通孔 包括盲孔 埋孔 的孔径 0 1毫米 孔环 0 25毫米 微导通孔的孔密度 600孔 平方英寸 导线宽 间距 0 10毫米 什么样的板是什么样的板是HDI板 板 PDF created with pdfFactory trial version P 6 300400500 Ball Terminal Pitch um 50 10070 150100 250 Interstitial Via Hole IVH Diameter Hole Land um 35 3550 5075 75Line Space um 80 to 3080 to 40
4、80 to 40 Thickness between layers um 200720062005Year Note This table is compiled by various acquired at JPCA Show 2005 HDI工艺发展趋势工艺发展趋势 PDF created with pdfFactory trial version P 7 Product Type Mobile Phone Base Station Automatic Switch PDA Digital camera Wireless Card Laptop Computer SBU Material
5、RCC Aramid FR4 Prepreg Ablation mode CO2 UV Laser IVH hole filling material RCC FR4 Prepreg PHP900 UC3000 150 Typical Products 1 N 1 SKA188A 2 N 2 UHB020A 3 N 3 D8B051A N N UE0444A Product Type Mobile Phone Base Station Automatic Switch PDA Digital camera Wireless Card Laptop Computer SBU Material R
6、CC Aramid FR4 Prepreg Ablation mode CO2 UV Laser IVH hole filling material RCC FR4 Prepreg PHP900 UC3000 150 Typical Products 1 N 1 SKA188A 2 N 2 UHB020A 3 N 3 D8B051A N N UE0444A HDI产品类型产品类型 PDF created with pdfFactory trial version P 8 v Type I One level HDI Without IVH FeatureFeature Micro sectio
7、nMicro section One level HDI PDF created with pdfFactory trial version P 9 v Type I One level HDI With IVH FeatureFeature Micro sectionMicro section One level HDI PDF created with pdfFactory trial version P 10 v Type I One level HDI Cap of Buried hole FeatureFeature Micro sectionMicro section One le
8、vel HDI PDF created with pdfFactory trial version P 11 v Type I One level HDI With IVH Process Flow Inner layer D F AOI Inner layer D F AOI FQC FQC Profiling Profiling Surface Treatment Surface Treatment S M C M S M C M Conformal Mask Conformal Mask Laser Drilling Laser Drilling Mechanical Drilling
9、Mechanical Drilling PTH PTH IVH D F AOI IVH D F AOI Pattern Plating Pattern Plating SES SES Shipment Shipment Pressing X Ray Pressing X Ray Mechanical Drilling Mechanical Drilling PTH PTH Outer D F Outer D F Pressing X Ray Pressing X Ray One level HDI PDF created with pdfFactory trial version P 12 v
10、 Type II Two level HDI Staggered via FeatureFeature Micro sectionMicro section Two level HDI PDF created with pdfFactory trial version P 13 v Type II Two level HDI Skip via FeatureFeature Micro sectionMicro section Two level HDI PDF created with pdfFactory trial version P 14 v Type II Two level HDI
11、Stacked via FeatureFeature Micro sectionMicro section UV CO2 Laser drill Stack via Two level HDI PDF created with pdfFactory trial version P 15 v Type II Two level HDI Stacked via FeatureFeature Micro sectionMicro section Copper filling stacked via Two level HDI PDF created with pdfFactory trial ver
12、sion P 16 v Type II Two level HDI Telescopic via FeatureFeature Micro sectionMicro section Two level HDI PDF created with pdfFactory trial version P 17 v Type II Two level HDI With IVH Process Flow SES SES FQC FQC Profiling Profiling Surface Treatment Surface Treatment S M C M S M C M Shipment Shipm
13、ent Inner layer D F AOI Inner layer D F AOI Pattern Plating Pattern Plating SBU2 D F SBU2 D F PTH PTH Mechanical Drilling Mechanical Drilling Conformal Mask Conformal Mask Laser Drilling Laser Drilling Mechanical Drilling Mechanical Drilling PTH PTH IVH D F AOI IVH D F AOI Conformal Mask Conformal M
14、ask Laser Drilling Laser Drilling Pressing2 X Ray Pressing2 X Ray PTH PTH SBU1 D F AOI SBU1 D F AOI Pressing3 X Ray Pressing3 X Ray Pressing1 X Ray Pressing1 X Ray Two level HDI PDF created with pdfFactory trial version P 18 v Type III Three level HDI Staggered via FeatureFeature Micro sectionMicro
15、section Three level HDI PDF created with pdfFactory trial version P 19 v Type III Three level HDI Stacked via Resin filling FeatureFeature Micro sectionMicro section Three level HDI PDF created with pdfFactory trial version P 20 v Type III Three level HDI Stacked via Copper filling FeatureFeature Mi
16、cro sectionMicro section Three level HDI PDF created with pdfFactory trial version P 21 v Type III Three level HDI With IVH Process Flow Laser Drilling Laser Drilling Pattern Plating Pattern Plating SBU3 D F SBU3 D F PTH PTH Mechanical Drilling Mechanical Drilling SES SES Inner layer D F AOI Inner layer D F AOI Conformal Mask Conformal Mask Pressing4 X Ray Pressing4 X Ray SBU2 D F AOI SBU2 D F AOI PTH or Copper filling PTH or Copper filling Conformal Mask Conformal Mask Laser Drilling Laser Dril
