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1、南京航空航天大学 硕士学位论文 大功率LED灯用敷铜陶瓷基板的制备及性能研究 姓名：俞晓东 申请学位级别：硕士 专业：材料学 指导教师：傅仁利 2011-03 南京航空航天大学硕士学位论文 I 摘 要 本文采用厚膜印刷工艺，以含铜氧化物粉体为功能相，通过添加有机载体、无玻璃型粘结 相，制备了适合氧化铝陶瓷基板丝网印刷的电子浆料体系。随后通过烧结、还原和电镀工艺制 备出可用于大功率 LED 封装的敷铜陶瓷基板。采用 XRD 对敷铜基板试样物相结构进行分析， 利用扫描电子显微镜(SEM)及光学显微镜对制备试样的表面及界面微观结构进行观察，测试和 分析了基板的电学、力学和热学性能，利用 ANSYS
2、软件对敷铜陶瓷基板进行导热模拟和预测。 将敷铜陶瓷基板用于大功率 LED 封装结构中，对封装 LED 结构的结温及光衰等问题进行了初 步研究和评价。 研究结果表明： 1) 所研制的铜系电子浆料具有很好的稳定性及优良的流变性能， 丝网印刷图形精度高；2) 烧结过程中，界面处会产生新相 CuAlO2，其是提高敷铜陶瓷基板敷 接强度的主要原因；3) 在 600C，N2/H2气氛条件下还原铜层具有较低的表面电阻率，并为后 续致密化电镀工艺提供导电铜层；4) 通过电镀工艺可以制备敷接强度为 10.28kg/mm2，铜层厚 度为 60 m，热导率为 9.38W/m K 的敷铜陶瓷基板；5) 理论预测与实验
3、结果对比，减小界面层 厚度是提高基板导热性能的主要途径， 当界面层厚度为 3 m 时， 所得基板敷接强度为 5kg/mm2， 热导率为 28 W/mK。采用敷铜陶瓷基板封装的大功率 LED，在 20W 功率条件下引脚端温度仅 为 29.4C，最大光衰程度为 2.9%，有效地提高了大功率 LED 的可靠性及寿命。 关键词：厚膜印刷工艺，电子浆料，敷铜陶瓷基板，敷接强度，热导率 大功率 LED 灯用敷铜陶瓷基板的制备及性能研究 II Abstract In this paper, thick film printing method was used. The optimized electron
4、ic slurry was chosen by adding cuprous oxide power, organic carrier and no glass- based bonding phase. Followed by sintering, reduction and plating process, the deposition of copper on ceramic substrate used in high- power LED was prepared. The outer fired layers were analysed by X- ray diffraction
5、(XRD). The microstructure and morphology of reduced samples were examined by scanning electron microscopy (SEM) and optical microscopy (OM). The electrical, mechanical and thermal performence were tested and analysed. Subsequently, ANSYS was used for thermal simulation and prediction of substrate mo
6、dels. Finally, the samples were used in high- power LED system, and its influence on junction temperature and luminous flux degradation were studyed. Experimental results show: i) The optimum slurry with the best e lectronic stability and good rheological properties was prepared by adding a small am
7、ount of additives and organic carrier with 57wt.% terpineol, 28.5wt.% butyl carbitol acetate, 9.5wt.% dibutyl phthalate and 5wt.% ethyl cellulose. ii) Upon heat- treatment above 1000C, new phase CuAlO2 which would improve the bonding strength of substrate was formed at Cu2O- Al2O3 interface, and the
8、 optimum sintering temperature was 1150C. iii) Reduction process could not only change the thickness of interface layer but also change the surface resistivity of copper, and 30min at 600C was the best process. iv) The plating process was the best when the current density was 5A/dm2, the temperature
9、 was 30C, concentration of H 2SO4 was 50g/L, plating time was 30min, and the bonding strength was 10.28kg/mm2, the thickness of copper layer was 60m, the thermal conductivity was 9.38W/m K. v) Comparing with theoretical predict, the thermal performance of substrate could be improved by reducing the
10、thickness of interface layer. The bonding strength of substrate would be 5kg/mm2 and the thermal conductivity would be 28W/m K when the thickness of interface layer was 3m, which indicated the broad market prospect. vi) Ceramic substrate was applied in high- power LED, it was found that the temperat
11、ure of pin- side is only 29.4C under 20W power condition, and the greatest Luminous flux degradation was 2.9%, which improved the reliability and lifetime of high- power LED. Keywords: Thick film printing method, Electronic slurry, Deposition of copper on ceramic substrate, Bonding strength, Thermal
12、 conductivity 大功率 LED 灯用敷铜陶瓷基板的制备及性能研究 VI 图表清单 图清单 图 1.1 LED 基本构造图.2 图 1.2 LED 载流子复合示意图.2 图 1.3 LED 封装结构的演变以及热阻的变化趋势.3 图 1.4 芯片的正装结构与倒装结构示意图.4 图 1.5 陶瓷基板 LED 阵列.5 图 1.6 米字型上下电极结构.5 图 1.7 MCPCB 覆晶式功率型 LED.6 图 1.8 一种 LED 多芯片封装模型的示意图.7 图 2.1 有机载体制备装置图.13 图 2.2 铜系电子浆料的配制流程图.14 图 2.3 印刷电路图形实物图.15 图 2.4 铜系电子浆料烧结温度曲线.16 图 2.5 纯溶剂在一定温度下保温 20min 后的挥发量.
