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1、Rev. 1.5 3/12Copyright 2012 by Silicon LaboratoriesSi8440/41/42/45 Si8440/41/42/45 LOW-POWER QUAD-CHANNEL DIGITAL ISOLATOR Features Applications Safety Regulatory Approvals Description Silicon Labs family of ultra-low-power digital isolators are CMOS devices offering substantial data rate, propagati
2、on delay, power, size, reliability, and external BOM advantages when compared to legacy isolation technologies. The operating parameters of these products remain stable across wide temperature ranges throughout their service life. For ease of design, only VDD bypass capacitors are required. Data rat
3、es up to 150 Mbps are supported, and all devices achieve worst-case propagation delays of less than 10 ns. All products are safety certified by UL, CSA, and VDE and support withstand voltages of up to 2.5 kVrms. These devices are available in 16-pin wide- and narrow-body SOIC packages. High-speed op
4、eration DC to 150 Mbps No start-up initialization required Wide Operating Supply Voltage: 2.705.5 V Wide Operating Supply Voltage: 2.705.5V Ultra low power (typical) 5 V Operation: 9 s for a 4.5 V supply). Although rise time is power supply dependent, 1 F capacitors are required on both power supply
5、 pins (VDD1, VDD2) of the isolator device. 3.2.1. Resolution For recommendations on resolving this issue, see “2.4.1. Supply Bypass“ on page 22. Additionally, refer to “5. Ordering Guide“ on page 27 for current ordering information. 3.3. Latch Up Immunity (Revision C Only) Latch up immunity generall
6、y exceeds 200 mA per pin. Exceptions: Certain pins provide 100 mA of latch-up immunity. To increase latch-up immunity on these pins, 100 of equivalent resistance must be included in series with all of the pins listed in Table 14. The 100 equivalent resistance can be comprised of the source drivers o
7、utput resistance and a series termination resistor. The Si8441 is not affected when using power supply voltages (VDD1 and VDD2) 3.5 V. 3.3.1. Resolution This issue has been corrected with Revision D of the device. Refer to “5. Ordering Guide” for current ordering information. Table 14. Affected Orde
8、ring Part Numbers (Revision C Only) Affected Ordering Part Numbers* Device Revision Pin# NamePin Type SI8440SV-C-IS/IS1, SI8441SV-C-IS/IS1, SI8442SV-C-IS/IS1 C 6A4Input or Output 10EN2Input 14B1Output SI8445SV-C-IS/IS1C 6A4Input 14B1Output *Note: SV = Speed Grade/Isolation Rating (AA, AB, BA, BB). S
9、i8440/41/42/45 26Rev. 1.5 4. Pin Descriptions NameSOIC-16 Pin#Type Description1 VDD11SupplySide 1 power supply. GND12GroundSide 1 ground. A13Digital InputSide 1 digital input. A24Digital InputSide 1 digital input. A35Digital I/OSide 1 digital input or output. A46Digital I/OSide 1 digital input or ou
10、tput. EN1/NC27Digital InputSide 1 active high enable. NC on Si8440/45. GND18GroundSide 1 ground. GND29GroundSide 2 ground. EN2/NC210Digital InputSide 2 active high enable. NC on Si8445. B411Digital I/OSide 2 digital input or output. B312Digital I/OSide 2 digital input or output. B213Digital OutputSi
11、de 2 digital output. B114Digital OutputSide 2 digital output. GND215GroundSide 2 ground. VDD216SupplySide 2 power supply. Notes: 1. For narrow-body devices, Pin 2 and Pin 8 GND must be externally connected to respective ground. Pin 9 and Pin 15 must also be connected to external ground. 2. No Connec
12、t. These pins are not internally connected. They can be left floating, tied to VDD or tied to GND. VDD1 GND1 A1 A3 A4 EN1 GND1 A2 VDD2 GND2 B2 B1 B4 B3 GND2 EN2 I s o l a t i o n RF XMITR RF RCVR RF XMITR RF RCVR RF XMITR RF RCVR RF XMITR RF RCVR Si8441 VDD1 GND1 A1 A3 A4 NC GND1 A2 VDD2 GND2 B2 B1
13、B4 B3 GND2 EN2/NC I s o l a t i o n RF XMITR RF RCVR RF XMITR RF RCVR RF XMITR RF RCVR RF XMITR RF RCVR Si8440/45 VDD1 GND1 A1 A3 A4 EN1 GND1 A2 VDD2 GND2 B2 B1 B4 B3 GND2 EN2 I s o l a t i o n RF XMITR RF RCVR RF XMITR RF RCVR RF RCVR RF XMITR RF RCVR RF XMITR RF RCVR Si8442 Si8440/41/42/45 Rev. 1.
14、527 5. Ordering Guide Revision D devices are recommended for all new designs. Table 15. Ordering Guide for Valid OPNs1 Ordering Part Number (OPN) Number of Inputs VDD1 Side Number of Inputs VDD2 Side Maximum Data Rate (Mbps) Isolation Rating Temp RangePackage Type Revision D Devices2 Si8440AA-D-IS14
15、01 1 kVrms40 to 125 C NB SOIC-161 Si8440BA-D-IS140150 Si8441AA-D-IS1311 Si8441BA-D-IS131150 Si8442AA-D-IS1221 Si8442BA-D-IS122150 Si8445BA-D-IS140150 Si8440AB-D-IS401 2.5 kVrms40 to 125 C WB SOIC-161,3 Si8440BB-D-IS40150 Si8441AB-D-IS311 Si8441BB-D-IS31150 Si8442AB-D-IS 221 Si8442BB-D-IS22150 Si8445
16、BB-D-IS40150 Si8440AB-D-IS1401 2.5 kVrms40 to 125 C NB SOIC-161 Si8440BB-D-IS140150 Si8441AB-D-IS1311 Si8441BB-D-IS131150 Si8442AB-D-IS1221 Si8442BB-D-IS122150 Si8445BB-D-IS140150 Notes: 1. All packages are RoHS-compliant with peak reflow temperatures of 260 C according to the JEDEC industry standard classifications and peak solder temperatures. Moisture sensitivity level is MSL2A for wide-body SOIC-16 packages. Moisture sensitivity level is MSL2A for narrow-body S
