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1、 Everlight Electronics Co., Ltd. http: Rev 1 Page: 1 of 10 Device No： DTT-026-269 Prepared date： 03-06-2007 Prepared by： Posen Hsu Technical Data Sheet 1.6mm Round Subminiature Side Looking Phototransiator PT26-51B/TR8 Features Fast response time High photo sensitivity Small junction capacitance Pac
2、kage in 8mm tape on 7” diameter reels. Pb free The product itself will remain within RoHS compliant version. Descriptions PT26-51B/TR8(ES) is a phototransistor in miniature SMD package which is molded in a black with spherical top view lens. The device is Spectrally matched to infrared emitting diod
3、e. Applications Miniature switch Counters and sorter Position sensor Infrared applied system Device Selection Guide Chip LED Part No. Material Lens Color PT Silicon Black 020-22074733 QQ 2462655096 Everlight Electronics Co., Ltd. http: Rev 1 Page: 2 of 10 Device No： DTT-026-269 Prepared date： 03-06-
4、2007 Prepared by： Posen Hsu CollectorEmitterPT26-51B/TR8 Package Dimensions Notes: 1.All dimensions are in millimeters 2.Tolerances unless dimensions 0.1mm Absolute Maximum Ratings (Ta=25 ) Parameter Symbol Rating Units Collector-Emitter Voltage VCEO30 V Emitter-Collector-Voltage VECO5 V Collector C
5、urrent IC20 mA Operating Temperature Topr-25 +85 Storage Temperature Tstg-40 +100 Soldering Temperature Tsol260 Power Dissipation at(or below) 25 Free Air Temperature Pc75 mW Notes: *1:Soldering time 5 seconds. Everlight Electronics Co., Ltd. http: Rev 1 Page: 3 of 10 Device No： DTT-026-269 Prepared
6、 date： 03-06-2007 Prepared by： Posen Hsu PT26-51B/TR8 Electro-Optical Characteristics (Ta=25 ) Parameter Symbol Condition Min Typ Max UnitRang Of Spectral Bandwidth 0.5 - 730 - 1100 nm Wavelength Of Peak Sensitivity P - - 940 - nm Collector-Emitter Breakdown Voltage BVCEOIC=500 A Ee=0mW/cm260 - - V
7、Emitter-Collector Breakdown Voltage BVECOIE=50 A Ee=0mW/cm27 - - V Collector-Emitter Saturation Voltage VCE(sat)IC=5mA Ee=1mW/cm2- - 0.4 V Collector Dark Current ICEOVCE=20V Ee=0mW/cm2- - 100 nA On State Collector Current IC(ON)VCE=5V Ee=1mW /cm2 P=940nm - 1.0 - mARise Time tr- 15 - Fall Time tfVCE=
8、5V IC=1mA RL=1000 - 15 - S Everlight Electronics Co., Ltd. http: Rev 1 Page: 4 of 10 Device No： DTT-026-269 Prepared date： 03-06-2007 Prepared by： Posen Hsu 0-252040500 25 8575 100608010020004010 20 30 6050 7010060408014012016020600 7000.20.40.60.8Ta=25OC1.01100800 900 1000 120020.01 0.1 110C0.010.1
9、110100PT26-51B/TR8 Typical Electro-Optical Characteristics Curves Fig.1Collector Power Dissipation vs. Fig.2 Spectral Sensitivity Ambient Temperature Fig.3 Relative Collector Current vs. Fig.4 Collector Current vs. Ambient Temperature Irradiance Everlight Electronics Co., Ltd. http: Rev 1 Page: 5 of
10、 10 Device No： DTT-026-269 Prepared date： 03-06-2007 Prepared by： Posen Hsu 1010010101025 50 75 100PT26-51B/TR8 Typical Electro-Optical Characteristics Curves Fig.5 Collector Dark Current vs. Fig.6 Collector Current vs. Ambient Temperature Collector-Emitter Voltage 0012374123456 Everlight Electronic
11、s Co., Ltd. http: Rev 1 Page: 6 of 10 Device No： DTT-026-269 Prepared date： 03-06-2007 Prepared by： Posen Hsu PT26-51B/TR8 Precautions For Use 1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2
12、. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be kept at 30 or less and 90%RH or less. 2.3 The LEDs should be used within a year. 2.4 After opening the package, the LEDs should be kept at 30 or less and 70%RH or les
13、s. 2.5 The LEDs should be used within 168 hours (7 days) after opening the package. 2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 605 for 24 hours.
14、 3. Soldering Condition 3.1 Pb-free solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. http: Rev 1 Page: 7 of 10
