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1、一 综合词汇印制电路：printed circuit印制线路：printed wiring印制板：printed board印制板电路：printed circuit board (PCB)印制线路板：printed wiring board(PWB)印制元件：printed component印制接点：printed contact印制板装配：printed board assembly板：board单面印制板：single-sided printed board(SSB)双面印制板：double-sided printed board(DSB)多层印制板：mulitlayer printe
2、d board(MLB)多层印制电路板：mulitlayer printed circuit board多层印制线路板：mulitlayer prited wiring board刚性印制板：rigid printed board刚性单面印制板：rigid single-sided printed borad刚性双面印制板：rigid double-sided printed borad刚性多层印制板：rigid multilayer printed board挠性多层印制板：flexible multilayer printed board挠性印制板：flexible printed boa
3、rd挠性单面印制板：flexible single-sided printed board挠性双面印制板：flexible double-sided printed board挠性印制电路：flexible printed circuit (FPC)挠性印制线路：flexible printed wiring刚性印制板：flex-rigid printed board, rigid-flex printed board刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed刚性多层印制板：fle
4、x-rigid multilayer printed board, rigid-flex multilayer printed board齐平印制板：flush printed board金属芯印制板：metal core printed board金属基印制板：metal base printed board多重布线印制板：mulit-wiring printed board陶瓷印制板：ceramic substrate printed board导电胶印制板：electroconductive paste printed board模塑电路板：molded circuit board模压印
5、制板：stamped printed wiring board顺序层压多层印制板：sequentially-laminated mulitlayer散线印制板：discrete wiring board微线印制板：micro wire board积层印制板：buile-up printed board积层多层印制板：build-up mulitlayer printed board (BUM)积层挠印制板：build-up flexible printed board表面层合电路板：surface laminar circuit (SLC)埋入凸块连印制板：B2it printed board
6、多层膜基板：multi-layered film substrate(MFS)层间全内导通多层印制板：ALIVH multilayer printed board载芯片板：chip on board (COB)埋电阻板：buried resistance board母板：mother board子板：daughter board背板：backplane裸板：bare board键盘板夹心板：copper-invar-copper board动态挠性板：dynamic flex board静态挠性板：static flex board可断拼板：break-away planel电缆：cable挠
7、性扁平电缆：flexible flat cable (FFC)薄膜开关：membrane switch混合电路：hybrid circuit厚膜：thick film厚膜电路：thick film circuit薄膜：thin film薄膜混合电路：thin film hybrid circuit互连：interconnection导线：conductor trace line齐平导线：flush conductor传输线：transmission line跨交：crossover板边插头：edge-board contact增强板：stiffener基底：substrate基板面：real
8、estate导线面：conductor side元件面：component side焊接面：solder side印制：printing网格：grid图形：pattern导电图形：conductive pattern非导电图形：non-conductive pattern字符：legend标志：mark二 基材：基材：base material层压板：laminate覆金属箔基材：metal-clad bade material覆铜箔层压板：copper-clad laminate (CCL)单面覆铜箔层压板：single-sided copper-clad laminate双面覆铜箔层压板：
9、double-sided copper-clad laminate复合层压板：composite laminate薄层压板：thin laminate金属芯覆铜箔层压板：metal core copper-clad laminate金属基覆铜层压板：metal base copper-clad laminate挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film基体材料：basis material预浸材料：prepreg粘结片：bonding sheet预浸粘结片：preimpregnated bonding sheer环氧玻璃基板：epoxy gla
10、ss substrate加成法用层压板：laminate for additive process预制内层覆箔板：mass lamination panel内层芯板：core material催化板材：catalyzed board ,coated catalyzed laminate涂胶催化层压板：adhesive-coated catalyzed laminate涂胶无催层压板：adhesive-coated uncatalyzed laminate粘结层：bonding layer粘结膜：film adhesive涂胶粘剂绝缘薄膜：adhesive coated dielectric f
11、ilm无支撑胶粘剂膜：unsupported adhesive film覆盖层：cover layer (cover lay)增强板材：stiffener material铜箔面：copper-clad surface去铜箔面：foil removal surface层压板面：unclad laminate surface基膜面：base film surface胶粘剂面：adhesive faec原始光洁面：plate finish粗面：matt finish纵向：length wise direction模向：cross wise direction剪切板：cut to size pane
12、l酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates环氧玻璃布玻璃纤
13、维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates环氧合成纤维布覆铜箔板：epoxide
14、synthetic fiber fabric copper-clad laminates聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates超薄型层压板：ultra thin laminate陶瓷基覆铜箔板：ceramics base copper-clad laminates紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates三 基材的材料A阶树脂：A-stage resinB阶树脂：B-stage resinC阶树脂：C-stage resin环氧树脂：epoxy resin酚醛树脂：phenolic
15、 resin聚酯树脂：polyester resin聚酰亚胺树脂：polyimide resin双马来酰亚胺三嗪树脂：bismaleimide-triazine resin丙烯酸树脂：acrylic resin三聚氰胺甲醛树脂：melamine formaldehyde resin多官能环氧树脂：polyfunctional epoxy resin溴化环氧树脂：brominated epoxy resin环氧酚醛：epoxy novolac氟树脂：fluroresin硅树脂：silicone resin硅烷：silane聚合物：polymer无定形聚合物：amorphous polymer结晶现象：crystalline polamer双晶现象：dimorphism共聚物：copolymer合成树脂：synthetic热固性树脂：thermosetting resin热塑性树脂：thermoplastic resin感光性树脂：photosensitive resin环氧当量：weight per epoxy equivalent
