《印制电路板相关英语词汇.》由会员分享,可在线阅读,更多相关《印制电路板相关英语词汇.(12页珍藏版)》请在金锄头文库上搜索。
1、一 综合词汇印制电路:printed circuit印制线路:printed wiring印制板:printed board印制板电路:printed circuit board (PCB)印制线路板:printed wiring board(PWB)印制元件:printed component印制接点:printed contact印制板装配:printed board assembly板:board单面印制板:single-sided printed board(SSB)双面印制板:double-sided printed board(DSB)多层印制板:mulitlayer printe
2、d board(MLB)多层印制电路板:mulitlayer printed circuit board多层印制线路板:mulitlayer prited wiring board刚性印制板:rigid printed board刚性单面印制板:rigid single-sided printed borad刚性双面印制板:rigid double-sided printed borad刚性多层印制板:rigid multilayer printed board挠性多层印制板:flexible multilayer printed board挠性印制板:flexible printed boa
3、rd挠性单面印制板:flexible single-sided printed board挠性双面印制板:flexible double-sided printed board挠性印制电路:flexible printed circuit (FPC)挠性印制线路:flexible printed wiring刚性印制板:flex-rigid printed board, rigid-flex printed board刚性双面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed刚性多层印制板:fle
4、x-rigid multilayer printed board, rigid-flex multilayer printed board齐平印制板:flush printed board金属芯印制板:metal core printed board金属基印制板:metal base printed board多重布线印制板:mulit-wiring printed board陶瓷印制板:ceramic substrate printed board导电胶印制板:electroconductive paste printed board模塑电路板:molded circuit board模压印
5、制板:stamped printed wiring board顺序层压多层印制板:sequentially-laminated mulitlayer散线印制板:discrete wiring board微线印制板:micro wire board积层印制板:buile-up printed board积层多层印制板:build-up mulitlayer printed board (BUM)积层挠印制板:build-up flexible printed board表面层合电路板:surface laminar circuit (SLC)埋入凸块连印制板:B2it printed board
6、多层膜基板:multi-layered film substrate(MFS)层间全内导通多层印制板:ALIVH multilayer printed board载芯片板:chip on board (COB)埋电阻板:buried resistance board母板:mother board子板:daughter board背板:backplane裸板:bare board键盘板夹心板:copper-invar-copper board动态挠性板:dynamic flex board静态挠性板:static flex board可断拼板:break-away planel电缆:cable挠
7、性扁平电缆:flexible flat cable (FFC)薄膜开关:membrane switch混合电路:hybrid circuit厚膜:thick film厚膜电路:thick film circuit薄膜:thin film薄膜混合电路:thin film hybrid circuit互连:interconnection导线:conductor trace line齐平导线:flush conductor传输线:transmission line跨交:crossover板边插头:edge-board contact增强板:stiffener基底:substrate基板面:real
8、estate导线面:conductor side元件面:component side焊接面:solder side印制:printing网格:grid图形:pattern导电图形:conductive pattern非导电图形:non-conductive pattern字符:legend标志:mark二 基材:基材:base material层压板:laminate覆金属箔基材:metal-clad bade material覆铜箔层压板:copper-clad laminate (CCL)单面覆铜箔层压板:single-sided copper-clad laminate双面覆铜箔层压板:
9、double-sided copper-clad laminate复合层压板:composite laminate薄层压板:thin laminate金属芯覆铜箔层压板:metal core copper-clad laminate金属基覆铜层压板:metal base copper-clad laminate挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film基体材料:basis material预浸材料:prepreg粘结片:bonding sheet预浸粘结片:preimpregnated bonding sheer环氧玻璃基板:epoxy gla
10、ss substrate加成法用层压板:laminate for additive process预制内层覆箔板:mass lamination panel内层芯板:core material催化板材:catalyzed board ,coated catalyzed laminate涂胶催化层压板:adhesive-coated catalyzed laminate涂胶无催层压板:adhesive-coated uncatalyzed laminate粘结层:bonding layer粘结膜:film adhesive涂胶粘剂绝缘薄膜:adhesive coated dielectric f
11、ilm无支撑胶粘剂膜:unsupported adhesive film覆盖层:cover layer (cover lay)增强板材:stiffener material铜箔面:copper-clad surface去铜箔面:foil removal surface层压板面:unclad laminate surface基膜面:base film surface胶粘剂面:adhesive faec原始光洁面:plate finish粗面:matt finish纵向:length wise direction模向:cross wise direction剪切板:cut to size pane
12、l酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates环氧玻璃布玻璃纤
13、维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates环氧合成纤维布覆铜箔板:epoxide
14、synthetic fiber fabric copper-clad laminates聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates超薄型层压板:ultra thin laminate陶瓷基覆铜箔板:ceramics base copper-clad laminates紫外线阻挡型覆铜箔板:UV blocking copper-clad laminates三 基材的材料A阶树脂:A-stage resinB阶树脂:B-stage resinC阶树脂:C-stage resin环氧树脂:epoxy resin酚醛树脂:phenolic
15、 resin聚酯树脂:polyester resin聚酰亚胺树脂:polyimide resin双马来酰亚胺三嗪树脂:bismaleimide-triazine resin丙烯酸树脂:acrylic resin三聚氰胺甲醛树脂:melamine formaldehyde resin多官能环氧树脂:polyfunctional epoxy resin溴化环氧树脂:brominated epoxy resin环氧酚醛:epoxy novolac氟树脂:fluroresin硅树脂:silicone resin硅烷:silane聚合物:polymer无定形聚合物:amorphous polymer结晶现象:crystalline polamer双晶现象:dimorphism共聚物:copolymer合成树脂:synthetic热固性树脂:thermosetting resin热塑性树脂:thermoplastic resin感光性树脂:photosensitive resin环氧当量:weight per epoxy equivalent