《pcb英文述语概要》由会员分享，可在线阅读，更多相关《pcb英文述语概要（24页珍藏版）》请在金锄头文库上搜索。
1、,電路板(PCB)字彙整理,PCB字典,2/P138,* Process Module 說明 : A. 下料 ( Cut Lamination) a-1 裁板 ( Sheets Cutting) a-2 原物料發料 (Panel)(Shear material to Size) B. 鑽孔 (Drilling) b-1 內鑽 (Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔 (2nd Drilling) b-4 雷射鑽孔 (Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔鑽孔 (B
2、lind & Buried Hole Drilling) C. 乾膜製程 ( Photo Process(D/F) c-1 前處理 (Pretreatment) c-2 壓 膜 (Dry Film Lamination) c-3 曝 光 (Exposure) c-4 顯 影 (Developing) c-5 蝕銅 (Etching) c-6 去膜 (Stripping) c-7 初檢 ( Touch-up) c-8 化學前處理,化學研磨 ( Chemical Milling ) c-9 選擇性浸金壓膜 (Selective Gold Dry Film Lamination) c-10 顯 影(
3、Developing ) c-11 去膜(Stripping ) D. 壓 合 Lamination d-1 黑 化 (Black Oxide Treatment) d-2 微 蝕 (Microetching),Developing , Etching & Stripping ( DES ),3/P138,d-3 鉚釘組合 (eyelet ) d-4 疊板 (Lay up) d-5 壓 合 (Lamination) d-6 後處理 (Post Treatment) d-7 黑氧化 ( Black Oxide Removal ) d-8 銑靶 (spot face) d-9 去溢膠 (resin
4、 flush removal) E. 減銅 (Copper Reduction) e-1 薄化銅(Copper Reduction) F. 電鍍 (Horizontal Electrolytic Plating) f-1 水平電鍍 (Horizontal Electro-Plating) (Panel Plating) f-2 錫鉛電鍍 ( Tin-Lead Plating ) (Pattern Plating) f-3 低於 1 mil ( Less than 1 mil Thickness ) f-4 高於 1 mil ( More than 1 mil Thickness) f-5 砂帶
5、研磨 (Belt Sanding) f-6 剝錫鉛 ( Tin-Lead Stripping) f-7 微切片 ( Microsection) G. 塞孔 (Plug Hole) g-1 印刷 ( Ink Print ) g-2 預烤 (Precure) g-3 表面刷磨 (Scrub) g-4 後烘烤 (Postcure) H. 防焊(綠漆): (Solder Mask) h-1 C面印刷 (Printing Top Side) h-2 S面印刷 (Printing Bottom Side) h-3 靜電噴塗 (Spray Coating) h-4 前處理 (Pretreatment) h-
6、5 預烤 (Precure) h-6 曝光 (Exposure) h-7 顯影 (Develop) h-8 後烘烤 (Postcure),4/P138,h-9 UV烘烤 (UV Cure) h-10 文字印刷 ( Printing of Legend ) h-11 噴砂 ( Pumice)(Wet Blasting) h-12 印可剝離防焊 (Peelable Solder Mask) I . 鍍金 Gold plating i-1 金手指鍍鎳金 ( Gold Finger ) i-2 電鍍軟金 (Soft Ni/Au Plating) i-3 浸鎳金 ( Immersion Ni/Au) (
7、Electroless Ni/Au) J. 噴錫 (Hot Air Solder Leveling) j-1 水平噴錫 (Horizontal Hot Air Solder Leveling) j-2 垂直噴錫 ( Vertical Hot Air Solder Leveling) j-3 超級焊錫 (Super Solder ) j-4. 印焊錫突點 (Solder Bump) K. 成型 (Profile)(Form) k-1 撈型 (N/C Routing ) (Milling) k-2 模具沖 (Punch) k-3 板面清洗烘烤 (Cleaning & Backing) k-4 V型
8、槽 ( V-Cut)(V-Scoring) k-5 金手指斜邊 ( Beveling of G/F) L. 短斷路測試 (Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光學檢查 ( AOI Inspection) l-2 VRS 目檢 (Verified & Repaired) l-3 汎用型治具測試 (Universal Tester) l-4 專用治具測試 (Dedicated Tester) l-5 飛針測試 (Flying Probe) M. 終檢 ( Final Visual Inspection) m-1
9、 壓板翹 ( Warpage Remove) m-2 X-OUT 印刷 (X-Out Marking) m-3 包裝 及出貨 (Packing & shipping),5/P138,m-4 目檢 ( Visual Inspection) m-5 清洗 及烘烤( Final Clean & Baking) m-6 護銅劑 (ENTEK Cu-106A)(OSP) m-7 離子殘餘量測試 (Ionic Contamination Test )(Cleanliness Test) m-8 冷熱衝擊試驗 (Thermal cycling Testing) m-9 焊錫性試驗 ( Solderabili
10、ty Testing ) N. 雷射鑽孔(Laser Ablation) N-1 雷射鑽Tooling孔 (Laser ablation Tooling Hole) N-2 雷射曝光對位孔(Laser Ablation Registration Hole) N-3 雷射Mask製作(Laser Mask) N-4 雷射鑽孔(Laser Ablation) N-5 AOI 檢查及VRS ( AOI Inspection & Verified & Repaired) N-6 Blaser AOI (after Desmear and Microetching) N-7 除膠渣 (Desmear)
11、N-8 微蝕 (Microetching ),6/P138,A/W (artwork) 底片 Ablation 燒溶(laser),切除 abrade 粗化 abrasion resistance 耐磨性 absorption 吸收 ACC ( accept ) 允收 accelerated corrosion test 加速腐蝕 accelerated test 加速試驗 acceleration 速化反應 accelerator 加速劑 acceptable 允收 activator 活化液 active work in process 實際在製品 adhesion 附著力 adhesiv
12、e method 黏著法 air inclusion 氣泡 air knife 風刀 amorphous change 不定形的改變 amount 總量 amylnitrite 硝基戊烷 analyzer 分析儀 anneal 回火 annular ring 環狀墊圈;孔環 anode slime (sludge) 陽極泥 anodizing 陽極處理 AOI ( automatic optical inspection ) 自動光學檢測 applicable documents 引用之文件 AQL sampling 允收水準抽樣 aqueous photoresist 液態光阻 aspect
13、 ratio 縱橫比(厚寬比) As received 到貨時,7/P138,back lighting 背光 back-up 墊板 banked work in process 預留在製品 base material 基材 baseline performance 基準績效 batch 批 beta backscattering 貝他射線照射法 beveling 切斜邊;斜邊 biaxial deformation 二方向之變形 black-oxide 黑化 blank controller 空白對照組,8/P138,blank panel 空板 blanking 挖空 blip 彈開 blister 氣泡;起泡 blistering 氣泡 blow hole 吹孔 board-thickness error 板厚錯誤 bonding plies 黏結層 bow ; bowing 板彎 break out 從平環內破出 bridging 搭橋;橋接 BTO (Build To Order) 接單生產 burning 燒焦 burr 毛邊(毛頭) camcorder 一體型攝錄放機 carbide 碳化物 carlson pin
